ASSMANN WSW IC Socket Adapter Straight Through Hole Mount 2.54 mm Pitch, DIP to DIP AR 18-ST/T

The ASSMANN WSW AR 18-ST/T is a high-quality IC Socket Adapter designed for electronic component interconnections requiring a reliable and robust DIP to DIP conversion. Featuring a 2.54 mm pitch, this adapter facilitates straightforward mounting through hole technology with a straight orientation, making it ideal for PCB socket adaptations.

Constructed with brass contacts plated with gold over nickel, it ensures excellent conductivity and corrosion resistance, crucial for industrial and laboratory electronic assemblies. The housing material is durable polybutylene terephthalate, enhancing mechanical strength and insulation.

Rated for a current capacity of 3A and a maximum operating voltage of 100V AC, this socket adapter supports a broad range of electronic equipment and circuitry. It is engineered to maintain secure and stable electrical contacts in through-hole mounting applications used in electronics manufacturing, hobbyist prototyping, and testing setups.

This adapter accommodates 18 male contacts on both connections, matching standard DIP IC configurations. Its straight orientation allows seamless integration into existing PCB layouts without the need for complex rerouting.

Designed for 18-pin DIP connections on both sides. Mount type is through hole with straight orientation. Contact plating features gold over nickel ensuring reliable conductivity. Supports a current rating of 3A and voltage up to 100V AC.

Contacts are made of brass with a polybutylene terephthalate housing for durability. This adapter facilitates easy DIP to DIP interconnection in PCB designs. Suitable for electronics assembly and prototyping applications.

Manufactured to meet industrial standards without specific certifications.

Ideal for industrial, educational, and prototyping environments, the ASSMANN WSW AR 18-ST/T IC Socket Adapter offers reliability and precision in electronic socket connections. It enhances production efficiency and device testing capability by allowing quick insertion and removal of ICs in DIP form factors.

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