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Winslow Straight Through Hole Mount 2.54 mm Pitch IC Socket Adapter QFN to DIP W13046RC
Specifications
| Country of Origin | United Kingdom |
|---|---|
| Brand | Winslow |
| Orientation | Straight |
| Model | W13046RC |
| Mount Type | Through Hole |
| Housing Material | Fibreglass |
| Contact Material | Brass |
| Pitch | 2.54mm |
| Connection Gender A | Female |
| Number of Contacts A | 12 |
| Connection Gender B | Male |
| Connection A | QFN |
| Connection B | DIP |
Key Features
- This adapter converts Quad-Flat No-Leads (QFN) packages to Dual In Line Package (DIP) style.
- It features 12 female contacts on QFN side and 12 male contacts on DIP side.
- The pitch between contacts is standard 2.54 mm suitable for easy PCB integration.
- Constructed with brass contact material and fibreglass housing for durability.
- Mounting type is through hole with straight orientation to fit PCB layouts.
- Designed and manufactured in the United Kingdom ensuring high-quality standards.
- This adapter is suitable for electronic component prototyping, testing, and development applications.
Product Description
Winslow W13046RC IC Socket Adapter is a precision straight through hole mount adapter designed to transition between QFN (Quad-Flat No-Leads) packages and DIP (Dual In Line Package) formats with a 2.54 mm contact pitch. It features 12 contacts on each side, with female gender on the QFN side and male on the DIP side, facilitating secure and reliable electrical connections.
Constructed with high-quality brass contacts and fibreglass housing, this adapter provides excellent durability and ensures stable signal transmission. The through hole mount type with straight orientation allows for straightforward and robust PCB assembly integration.
Manufactured in the United Kingdom, the W13046RC adapter meets stringent quality control standards. It is ideal for applications in electronics prototyping, circuit design, and development environments where conversion from QFN to DIP form factors is required for compatibility with standard DIP sockets or breadboards.
The adapter belongs to the 'Adaptics' range, allowing developers to reduce redesign costs by accommodating different package styles during board development. It supports efficient testing and iterative prototyping of electronic circuits.
This adapter converts Quad-Flat No-Leads and Dual-Flat No-Leads packages to DIP format. Equipped with 12 female contacts on the QFN side and 12 male pins on the DIP side. Standard pitch of 2.54 mm compatible with common PCB layouts.
Brass contact material ensures corrosion resistance and reliable conductivity. Fibreglass housing enhances mechanical stability and chemical resistance. Through hole mounting and straight orientation for easy PCB assembly.
Manufactured in the United Kingdom ensuring premium build quality.
This Winslow W13046RC IC Socket Adapter is broadly applicable in industrial electronics, laboratory setups, prototype development, and educational electronics design projects. It streamlines the integration of QFN package devices into legacy or DIP-based systems.
Explore the IC Socket Adapter category at EnvMart for compatible electronic components and accessories.
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Frequently Asked Questions
The contacts on this adapter have a standard pitch of 2.54 mm, making it suitable for common PCB layouts.
This model supports connections from Quad-Flat No-Leads (QFN) packages on one side to Dual In Line Package (DIP) formats on the other side.
It features 12 female contacts on the QFN side and 12 male contacts on the DIP side.
The adapter is constructed with brass for the contacts and fibreglass for the housing, ensuring durability and stability.
The mounting type of this adapter is through hole, designed for easy integration into PCB layouts.
This adapter is manufactured in the United Kingdom, adhering to high-quality standards.
The adapter features a straight orientation, which facilitates straightforward PCB assembly.
The connection on the QFN side is female, while the connection on the DIP side is male.
Yes, it supports efficient testing and iterative prototyping of electronic circuits, especially for QFN package devices.
The purpose of this adapter is to convert QFN packages to DIP format, allowing compatibility with standard DIP sockets or breadboards.
The use of brass contacts ensures reliable conductivity, which enhances stable signal transmission between the connected devices.
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