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Winslow Straight Through Hole Mount 2.54 mm Pitch IC Socket Adapter, QFP to PGA WA20850PRC
Specifications
| Country of Origin | United Kingdom |
|---|---|
| Brand | Winslow |
| Orientation | Straight |
| Model | WA20850PRC |
| Mount Type | Through Hole |
| Housing Material | Polyphenylene Sulphide |
| Contact Material | Beryllium Copper Alloy |
| Pitch | 2.54mm |
| Contact Plating | Gold, Tin |
| Connection Gender A | Female |
| Number of Contacts A | 208 |
| Connection A | QFP |
| Connection B | PGA |
Key Features
- This adapter provides a straight orientation through-hole mount for easy PCB integration.
- It supports 208-pin female QFP connection and 208-pin female PGA connection.
- Constructed with beryllium copper alloy contacts and polyphenylene sulphide housing for durability.
- Contact plating includes gold and tin to ensure reliable electrical conductivity.
- Adaptors include both the adapter body and mating PGA socket for a complete solution.
- The product is manufactured in the United Kingdom and meets no specific approvals or standards.
Product Description
Winslow WA20850PRC is a high-quality IC Socket Adapter designed for converting Quad Flat Pack (QFP) integrated circuits to Pin Grid Array (PGA) package footprints. This adapter features a straight through-hole mount configuration with a standard 2.54 mm pitch, ideal for industrial electronics and prototyping applications.
The adapter supports a 208-pin female QFP connection on one side and a 208-pin female PGA connection on the opposite side, facilitating flexible PCB layout adjustments without redesigning the board. Its beryllium copper alloy contacts are plated with gold and tin for exceptional conductivity and durability, ensuring long-term reliable electrical connections.
The housing is made of polyphenylene sulphide (PPS), providing robust mechanical strength and thermal stability required for demanding environments. The adapter is composed of two pieces: the epoxy fiberglass FR4 adapter body and the mating PGA socket, configured to provide seamless interface compatibility for various electronic components.
Engineered for electronic component manufacturers, laboratories, and industrial developers, this adapter helps reduce development costs by allowing reuse of PCBs across different IC package formats. It is highly applicable in research laboratories, manufacturing test setups, and prototype electronics assembly.
This adapter facilitates conversion from QFP to PGA IC packages. Gold and tin plating on contacts ensures excellent conductivity and corrosion resistance. Durable PPS housing and epoxy fiberglass body provide mechanical and thermal stability.
Two-piece design includes adapter and mating socket. Standard 2.54 mm pitch with straight orientation supports versatile PCB mounting. Manufactured in the United Kingdom ensuring quality standards in production. Explore similar IC socket adapters and connectors in the Electronics & Electricals section on EnvMart to find compatible components and accessories for your projects.
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Frequently Asked Questions
The pitch of this adapter is 2.54 mm, allowing for standard PCB integration.
It supports a 208-pin female QFP connection on one side and a 208-pin female PGA connection on the opposite side.
The contacts are made of beryllium copper alloy, while the housing is constructed from polyphenylene sulphide (PPS).
The adapter features a straight orientation for through-hole mounting.
This model has a total of 208 contacts for both the QFP and PGA connections.
This adapter is manufactured in the United Kingdom.
The contacts are plated with gold and tin to ensure reliable electrical conductivity and corrosion resistance.
The mount type for this adapter is through-hole, facilitating easy PCB integration.
It is designed to convert QFP integrated circuits to PGA package footprints, allowing for flexible PCB layout adjustments.
The package includes the adapter body and the mating PGA socket, providing a complete solution for connectivity.
The durable PPS housing and beryllium copper contacts provide mechanical strength and thermal stability, suitable for demanding environments.
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