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Winslow Straight Through Hole Mount 2.54 mm Pitch IC Socket Adapter QFN to DIP W13052RC

Specifications

Country of Origin United Kingdom
Brand Winslow
Orientation Straight
Model W13052RC
Mount Type Through Hole
Housing Material Fibreglass
Contact Material Brass
Pitch 2.54mm
Connection Gender A Female
Number of Contacts A 24
Connection Gender B Male
Connection A QFN
Connection B DIP

Key Features

  • Suitable for converting Dual-Flat No-Leads and Quad-Flat No-Leads packages to Dual In Line Package format.
  • Features 24 female contacts on QFN side and 24 male DIP contacts.
  • Constructed with brass contact material and fibreglass housing for durability.
  • Designed with straight orientation and through hole mount for easy PCB installation.
  • Manufactured in the United Kingdom ensuring quality craftsmanship.
  • Enables reduction of development costs by allowing board compatibility with alternative packages.
  • Ideal for electronic component prototyping and testing applications.

Product Description

The Winslow W13052RC is a high-quality IC socket adapter designed to convert Quad-Flat No-Leads (QFN) packages to Dual In Line Package (DIP) format using a 2.54 mm pitch through hole mount configuration.

Featuring 24 female contacts on the QFN side and 24 male contacts on the DIP side, this adapter facilitates seamless integration between different IC package types during prototyping or testing.

The adapter uses brass contacts to ensure reliable electrical conductivity and performance, embedded within a durable fibreglass housing that provides mechanical strength and resilience.

Its straight orientation and through hole mount allow straightforward assembly on printed circuit boards, making it perfect for electronic component design, development, and evaluation.

Manufactured in the United Kingdom, this adapter maintains strict quality standards and does not conform to additional certification approvals but delivers dependable function for engineering needs.

Suitable for converting Dual-Flat No-Leads and Quad-Flat No-Leads packages to DIP format. Contains 24 female QFN contacts and 24 male DIP contacts for precise connection. Contact material brass ensures durability and conductivity.

Fibreglass housing provides structural integrity and insulation. Straight orientation and through hole mount design for ease of PCB mounting. Manufactured in the United Kingdom with high-quality assembly. Reduces development costs by avoiding PCB redesign for alternative packages.

This IC socket adapter is an essential accessory for electronic laboratories, manufacturing testing, prototyping setups, and educational environments where IC package flexibility is required.

Explore a wide range of IC socket adapters at EnvMart to support your electronic component testing and development demands.

Explore more products in our Electronic Components, Power & Connectors category.

Winslow Straight Through Hole Mount 2.54 mm Pitch IC Socket Adapter QFN to DIP W13052RC
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Frequently Asked Questions

The pitch of the Winslow W13052RC IC socket adapter is 2.54 mm.

This model features 24 female contacts on the QFN side and 24 male contacts on the DIP side.

The adapter is constructed with brass contacts for electrical conductivity and a fibreglass housing for mechanical strength.

It utilizes a through hole mount design for easy installation on printed circuit boards.

The Winslow W13052RC has a straight orientation.

This adapter is manufactured in the United Kingdom.

It is suitable for converting Quad-Flat No-Leads (QFN) and Dual-Flat No-Leads packages to Dual In Line Package (DIP) format.

This unit is ideal for electronic component prototyping, testing applications, and environments where IC package flexibility is required.

The connection gender for the QFN side is female, and for the DIP side, it is male.

The adapter does not conform to additional certification approvals but is designed to deliver dependable function for engineering needs.

It facilitates seamless integration between different IC package types during prototyping or testing, reducing development time.

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