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Winslow Straight Through Hole Mount 2.54 mm Pitch IC Socket Adapter QFN to DIP W13091RC
Specifications
| Country of Origin | United Kingdom |
|---|---|
| Brand | Winslow |
| Orientation | Straight |
| Model | W13091RC |
| Mount Type | Through Hole |
| Housing Material | Fibreglass |
| Contact Material | Brass |
| Pitch | 2.54mm |
| Connection Gender A | Female |
| Number of Contacts A | 24 |
| Connection Gender B | Male |
| Connection A | QFN |
| Connection B | DIP |
Key Features
- Designed for QFN to DIP package adaptation.
- Features 24 female contacts on QFN side and 24 male contacts on DIP side.
- Pitch of 2.54 mm suitable for standard through-hole mounting.
- Constructed with brass contact material and fibreglass housing for durability.
- Mount type is through hole with straight orientation to facilitate PCB installation.
- Manufactured in the United Kingdom ensuring quality standards.
- Adaptic solution to reduce PCB redesign costs by enabling package conversions.
- Suitable for electronic and industrial applications requiring IC package adaptations.
Product Description
Winslow W13091RC Straight Through Hole Mount IC Socket Adapter features a 2.54 mm pitch designed to convert QFN (Quad-Flat No-Leads) packages to DIP (Dual In Line Package) format, simplifying PCB development and testing processes in electronics manufacturing.
This adapter offers 24 female contacts on the QFN side and 24 male contacts on the DIP side, ensuring secure and reliable electrical connections. The contacts are made of brass to provide excellent conductivity and durability, while the fibreglass housing delivers strong mechanical support and insulation.
With through hole mounting and a straight orientation, it fits standard PCB layouts and allows easy assembly. Its design serves as a cost-effective alternative to redesigning PCBs when adapting different IC package styles, making it ideal for prototyping, development, and repair tasks in industrial and laboratory electronic environments.
The product is manufactured in the United Kingdom, upholding high-quality standards. It finds applications across various sectors including industrial automation, manufacturing testing, and electronic component development.
Designed for QFN to DIP package adaptation. Features 24 female contacts on QFN side and 24 male contacts on DIP side. 2.54 mm pitch ideal for standard PCB compatibility. Brass contact material ensures conductivity and durability.
Fibreglass housing provides insulation and mechanical strength. Through hole mount with straight orientation for easy installation. Manufactured in the United Kingdom. Reduces development costs by avoiding PCB redesign. Explore our extensive range of IC socket adapters at EnvMart for diverse electronic assembly and testing solutions.
Explore more products in our Electronic Components, Power & Connectors category.
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Frequently Asked Questions
The pitch of this IC socket adapter is 2.54 mm, making it suitable for standard through-hole mounting on PCBs.
The QFN side of this adapter features 24 female contacts for secure connections.
The DIP side provides 24 male contacts for connection, facilitating the adaptation from QFN to DIP format.
The adapter is constructed with brass for the contacts, ensuring good conductivity, and fibreglass for the housing, providing insulation and mechanical strength.
This model features a straight orientation for easy installation on PCBs.
This IC socket adapter is manufactured in the United Kingdom, ensuring adherence to quality standards.
It utilizes a through hole mount type, which is standard for many PCB applications.
It is suitable for electronic and industrial applications requiring IC package adaptations, such as prototyping and testing.
The QFN side has 24 female contacts, designed to facilitate reliable electrical connections.
The purpose of this adapter is to convert QFN packages to DIP format, simplifying PCB development and testing processes.
It provides an adaptable solution that reduces the need for PCB redesign, making it useful for various electronic applications.
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