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OSI Optoelectronics Infrared Photodiode 65 ° Angle of Half Sensitivity Through Hole Mount PIN-SPOT-9DMI

Category Photodiode Brand OSI Optoelectronics Condition New

Specifications

Country of Origin United States
Diameter 25.4mm
Brand OSI Optoelectronics
Height 5mm
Length 24.81mm
Model PIN-SPOT-9DMI
Packaging Tape & Reel
Width 5mm
Mount Type Through Hole
Series Spot
Maximum Operating Temperature 85°C
Minimum Operating Temperature -25°C
Polarity Reverse
Dark Current 0.2nA
Standards/Approvals RoHS
Applications include Machine Tool Alignment, Position Measuring, Beam Centring, Surface Profiling and Targeting Guidance Systems
Number of Pins 5
Typical Fall Time 3ns
Wavelength of Peak Sensitivity 970nm
Spectrums Detected Infrared
Breakdown Voltage 30V
Minimum Wavelength Detected 350nm
Maximum Wavelength Detected 1100nm
Angle of Half Sensitivity 65 °

Key Features

  • Detects infrared spectrum with peak sensitivity at 970nm.
  • Features a through hole mount with 5 pins for stable connections.
  • Provides fast response times with typical rise and fall times of 3ns.
  • Operates reliably across temperatures from -25°C to 85°C.
  • Offers ultra-low dark current of 0.2nA ensuring high accuracy.
  • Constructed to RoHS standards for environmental compliance.
  • Designed for applications such as machine tool alignment and surface profiling.
  • Measures 25.4mm diameter and 5mm height for compact integration.

Product Description

OSI Optoelectronics PIN-SPOT-9DMI is an infrared photodiode with a 65 ° angle of half sensitivity, mounted using a through hole technique. It features a fast response suitable for high-speed or pulse operation with a spectral sensitivity range from 350nm to 1100nm, peaking at 970nm.

This photodiode incorporates a segmented design with separate active areas spaced by 0.127mm, providing high positional resolution better than 0.1μm. Such precision is ideal for industrial applications requiring exact measurements.

The device operates efficiently from -25°C to 85°C and maintains ultra-low dark current of 0.2nA, contributing to excellent response stability and accuracy over time and temperature variations.

Manufactured under RoHS compliance, the photodiode provides a breakdown voltage of 30V and includes 5 pins for secure through hole mounting integration. Detects infrared spectrum with peak wavelength at 970nm. Features a diameter of 25.4mm and height of 5mm for compact form factor.

Typical rise and fall times of 3ns enable rapid detection. Reverse polarity photodiode designed for reliable operation. Ideal for machine tool alignment, position measuring, beam centring, surface profiling, and targeting guidance systems.

Packaged in tape & reel format for efficient assembly processes. Applications of this photodiode span industrial, manufacturing, and scientific sectors where precise optical detection and positional feedback are critical.

Explore more Photodiodes and optoelectronic components at EnvMart for advanced electronics design and application needs.

OSI Optoelectronics Infrared Photodiode 65 ° Angle of Half Sensitivity Through Hole Mount PIN-SPOT-9DMI
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Frequently Asked Questions

The photodiode has a peak sensitivity at a wavelength of 970nm.

It operates reliably across a temperature range from -25°C to 85°C.

It features typical rise and fall times of 3ns, suitable for high-speed or pulse operation.

This model includes 5 pins for secure through hole mounting integration.

The photodiode has an ultra-low dark current of 0.2nA, ensuring high accuracy.

The breakdown voltage of this photodiode is 30V.

It has a diameter of 25.4mm and a height of 5mm, making it compact for integration.

This model is designed for applications such as machine tool alignment, position measuring, beam centring, surface profiling, and targeting guidance systems.

It detects a spectral range from 350nm to 1100nm, with peak sensitivity at 970nm.

It utilizes a through hole mount type for secure installation.

Yes, it is constructed to RoHS standards for environmental compliance.

This photodiode is packaged in tape & reel format for efficient assembly processes.

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