Samtec TSM Series Straight Surface Pin Header 5 Contacts 2.54 mm Pitch 1 Row Unshrouded TSM-105-01-T-SH

Samtec TSM-105-01-T-SH is a precision-engineered straight surface pin header designed for PCB connectivity with a pitch of 2.54 mm and 5 male contacts arranged in a single row.

Featuring phosphor bronze contact material with tin plating, it ensures excellent electrical conductivity and corrosion resistance. The housing is made from liquid crystal polymer, which offers high mechanical stability and thermal performance, rated for operation between -55°C and 105°C.

Its unshrouded design enables easy access for mating connectors, while the solder termination type is adapted for surface mount technology, supporting mixed technology assemblies typical in industrial electronics manufacturing.

With a current rating of 4A and a voltage rating of 475V, this header supports moderate electrical demands in various sectors such as industrial automation, telecommunications, and consumer electronics. The tail pin length is 4.57 mm with a mating pin length of 5.84 mm, providing reliable mechanical and electrical connections.

Rated current capacity of 4A suitable for moderate power applications. Constructed with phosphor bronze contacts plated with tin for good conductivity and corrosion resistance. Housing made from liquid crystal polymer providing high temperature resistance.

Unshrouded male contacts with a tail pin length of 4.57 mm and mating pin length of 5.84 mm. Designed for surface mount solder termination in mixed technology environments. Operational temperature range from -55°C to 105°C ensuring durability in harsh environments.

Voltage rating of 475V supporting robust electrical performance. Specifically designed for easy processing in surface mount applications.

This Samtec pin header is a suitable choice for electronic manufacturing applications requiring reliable PCB interconnections with standard pitch and current rating. It is commonly used in industrial, manufacturing, telecommunications, and electronic device assembly environments.

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