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onsemi 3-Input AND Logic Gate 14-Pin SOIC MC74AC11DR2G
Specifications
| Country of Origin | India |
|---|---|
| Brand | onsemi |
| Height | 1.5mm |
| Length | 8.75mm |
| Model | MC74AC11DR2G |
| Mount Type | Surface |
| Output type | TTL |
| Input Type | TTL |
| Maximum Operating Temperature | 85°C |
| Package Type | SOIC |
| Minimum Operating Temperature | -40°C |
| Pin Count | 14 |
| Number of Elements | 3 |
| Maximum Supply Voltage | 6V |
| Logic Family | AC |
| Logic Function | AND |
| Minimum Supply Voltage | 2V |
| Maximum High Level Output Current | -24mA |
| Maximum Propagation Delay Time @ CL | 8.5ns |
| Maximum Low Level Output Current | 24mA |
| Number of Inputs per Gate | 3 |
Key Features
- The device includes 3 logic elements, each being a 3-input AND gate.
- It comes in a compact 14-pin SOIC surface mount package.
- Designed for a supply voltage range of 2V to 6V.
- Operating temperature ranges from -40°C to 85°C.
- Maximum propagation delay time at capacitive load is 8.5 nanoseconds.
- Output current ranges up to ±24mA with TTL output type.
- The logic family is AC, enabling high-speed operation.
- Package dimensions include a length of 8.75mm and height of 1.5mm.
Product Description
onsemi MC74AC11DR2G 3-Input AND Logic Gate 14-Pin SOIC is a high-speed digital logic integrated circuit designed for reliable AND logic functionality in compact surface mount form factor. This SOIC package contains three independent 3-input AND gates operating with TTL input and output types within the AC logic family.
Operating at a minimum supply voltage of 2 volts up to a maximum of 6 volts, this device ensures flexibility for various electronic applications. The maximum propagation delay is only 8.5 nanoseconds at capacitive load, making it suitable for timing-sensitive logic operations.
Constructed to operate in the temperature range from -40°C to 85°C, it is designed for robust industrial and commercial environments. The maximum output current at high level is -24mA, and at low level is 24mA, supporting TTL output requirements.
The device has a compact physical footprint with dimensions including a length of 8.75mm and a height of 1.5mm. Its surface mount design allows for easy integration into PCBs where space-saving and automated assembly processes are critical.
This logic gate IC finds applications in industrial automation control systems, consumer electronics, communication equipment, and embedded systems requiring reliable digital logic decisions.
The device includes 3 logic elements, each being a 3-input AND gate. It comes in a compact 14-pin SOIC surface mount package. Designed for a supply voltage range of 2V to 6V. Operating temperature ranges from -40°C to 85°C.
Maximum propagation delay time at capacitive load is 8.5 nanoseconds. Output current ranges up to ±24mA with TTL output type. The logic family is AC, enabling high-speed operation. Package dimensions include a length of 8.75mm and height of 1.5mm.
The device is suitable for compact circuit designs and automation. No Schmitt Trigger inputs and no automotive standard compliance. Explore EnvMart for a wide range of semiconductor components and logic ICs including various Logic Gate devices from trusted brands like onsemi.
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Frequently Asked Questions
This model operates within a supply voltage range of 2V to 6V.
The maximum propagation delay time at capacitive load is 8.5 nanoseconds.
It operates within a temperature range from -40°C to 85°C.
Each gate in this device has 3 inputs.
The output type is TTL (Transistor-Transistor Logic).
The package dimensions include a length of 8.75mm and a height of 1.5mm.
The maximum high level output current is -24mA, and the maximum low level output current is 24mA.
It comes in a compact 14-pin SOIC surface mount package.
This device includes 3 independent logic elements, each being a 3-input AND gate.
The logic family is AC, which enables high-speed operation.
This device does not have Schmitt Trigger inputs and is not compliant with automotive standards.
It is suitable for applications in industrial automation control systems, consumer electronics, communication equipment, and embedded systems.
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