Winslow Straight Through Hole Mount 2.54 mm Pitch IC Socket Adapter QFN to DIP W13090RC

Winslow W13090RC IC Socket Adapter features a 2.54 mm pitch straight through hole mount designed for converting quad-flat no-leads (QFN) packages to dual in line package (DIP) format. This adapter is ideal for electronic development and prototyping when adapting different integrated circuit package types.

The product comprises 20 female contacts on the QFN connection side and 20 male contacts on the DIP side. The contacts are made of brass, ensuring reliable electrical connectivity. The fibreglass housing provides electrical insulation and mechanical robustness.

The through hole mount and straight orientation facilitate easy installation on printed circuit boards, enabling efficient assembly and testing processes in industrial, manufacturing, and laboratory environments.

Manufactured in the United Kingdom, this adapter does not possess specific industry approvals but is widely used in electronics design and prototyping. This adapter converts Dual-Flat No-Leads and Quad-Flat No-Leads packages to DIP format.

Contact materials are brass with fibreglass housing for durability. The pitch spacing is 2.54 mm, standard for DIP compatibility. Features 20 contacts on both QFN and DIP sides for proper pin alignment. Provides through hole mounting with a straight orientation for PCB assembly.

The Winslow W13090RC IC Socket Adapter is suitable for electronics, industrial prototyping, and manufacturing applications requiring package conversion. Explore a wide range of connectors and adapters in the EnvMart electronics category to find compatible solutions for your projects.