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Wurth Elektronik WE-TGF Series Thermal Gap Pad, 5 mm Thick, 3 W/mK Thermal Conductivity, 400 mm x 200 mm Ceramic 40003050
Specifications
| Country of Origin | India |
|---|---|
| Brand | Wurth Elektronik |
| Colour | Blue |
| THICKNESS | 5mm |
| Length | 400mm |
| Model | 40003050 |
| Width | 200mm |
| Series | WE-TGF |
| Maximum Operating Temperature | 180°C |
| Hardness | 20 Shore C |
| Thermal Conductivity | 3W/mK |
| Minimum Operating Temperature | -50°C |
| Trade Name | Würth Elektronik eiSos GmbH & Co. KG |
| Conductive Material | Ceramic Filled Silicone Rubber |
Key Features
- The thermal pad is made from ceramic filled silicone rubber for excellent thermal conduction.
- Hardness rating is 20 Shore C, balancing softness and durability.
- Operates reliably between -50°C and 180°C, ensuring stability under wide temperature ranges.
- Compliant with halogen free standards and RoHS, REACh regulations for environmental safety.
- Ideal for filling air gaps and uneven surface textures between heatsinks and electronic components.
- Blue color aids in visual identification during installation and maintenance.
Product Description
Wurth Elektronik 40003050 Thermal Gap Pad is a high-performance thermal interface material designed to improve heat dissipation between heatsinks and electronic devices. This ceramic filled silicone rubber pad provides a thickness of 5 mm and thermal conductivity of 3 W/mK, making it suitable for various industrial and electronic cooling applications.
The pad measures 400 mm in length and 200 mm in width with a hardness of 20 Shore C, offering a balance between flexibility and mechanical stability. This product operates effectively within a temperature range of -50°C to +180°C, making it ideal for demanding industrial environments including HVAC, electronics cooling, and thermal management systems.
Its ceramic filled silicone rubber composition ensures efficient thermal conduction while also being compliant with halogen free standards (JEDEC JS709B, IEC 61249-2-21) as well as REACh and RoHS environmental directives, guaranteeing safe use in sensitive and high-reliability applications.
Thermal gap pads like the WE-TGF series are essential where uneven surfaces or air gaps prevent effective heat transfer by pastes or greases. This pad provides a durable, reusable, and clean solution to lower thermal resistance at interfaces in manufacturing, electronics assembly, and maintenance.
The thermal pad is made from ceramic filled silicone rubber for excellent thermal conduction. Dimensions are 400 mm length by 200 mm width, suitable for large surface applications. Hardness rating is 20 Shore C, balancing softness and durability.
Operates reliably between -50°C and 180°C, ensuring stability under wide temperature ranges. Compliant with halogen free standards and RoHS, REACh regulations for environmental safety. Ideal for filling air gaps and uneven surface textures between heatsinks and electronic components.
Blue color aids in visual identification during installation and maintenance.
Commonly used in electronics manufacturing, HVAC systems, automotive electronics, and industrial equipment, this thermal pad enhances component reliability by effectively managing heat dissipation. Explore more thermal management solutions and accessories from Wurth Elektronik and other leading manufacturers on EnvMart.
Explore more products in our Thermal Pads category.
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Frequently Asked Questions
The thermal gap pad has a thickness of 5 mm.
It measures 400 mm in length and 200 mm in width, making it suitable for large surface applications.
The thermal conductivity of this pad is 3 W/mK, which aids in efficient heat dissipation.
It operates effectively between -50°C and 180°C, ensuring stability in various environments.
The pad is made from ceramic filled silicone rubber, which provides excellent thermal conduction.
It has a hardness rating of 20 Shore C, balancing softness and mechanical stability.
Yes, it is compliant with halogen free standards, RoHS, and REACh regulations for environmental safety.
The thermal pad is blue, which aids in visual identification during installation and maintenance.
It is commonly used in electronics manufacturing, HVAC systems, automotive electronics, and industrial equipment.
It is ideal for filling air gaps and uneven surface textures between heatsinks and electronic components to enhance heat transfer.
This thermal gap pad provides a durable, reusable, and clean solution to lower thermal resistance at interfaces in various applications.
The country of origin for this thermal gap pad is India.
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