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Wurth Elektronik WE-TGF Series Thermal Gap Pad, 1 mm Thick, 2 W/mK, 400 mm x 200 mm, Ceramic Filled Silicone Rubber 40104010
Specifications
| Country of Origin | India |
|---|---|
| Brand | Wurth Elektronik |
| Colour | Light Blue |
| THICKNESS | 1mm |
| Length | 400mm |
| Model | 40104010 |
| Width | 200mm |
| Series | WE-TGF |
| Maximum Operating Temperature | 180°C |
| Hardness | Shore C 20 |
| Thermal Conductivity | 2W/mK |
| Minimum Operating Temperature | -50°C |
| Standards/Approvals | RoHS |
| Conductive Material | Ceramic Filled Silicone Rubber |
Key Features
- The thermal pad measures 400 mm in length and 200 mm in width.
- Constructed from ceramic filled silicone rubber for excellent heat transfer.
- Operates reliably in temperature ranges from -50°C to 180°C.
- Shore C hardness rating of 20 ensures soft, compliant interface material.
- Ideal for bridging air gaps and uneven surfaces between heatsinks and electronic devices.
- RoHS compliant and REACH approved, ensuring environmental safety.
- Light blue color enhances visual identification during installation.
- The WE-TGF series offers durable and stable thermal interface solution for electronics cooling.
Product Description
Wurth Elektronik 40104010 thermal gap pad is engineered for effective thermal interface applications where air gaps, surface roughness, or surface unevenness prevent the use of greases or pastes. This pad is 1 mm thick and has a thermal conductivity of 2 W/mK, allowing efficient heat transfer between electronic components and heatsinks.
The pad dimensions of 400 mm length by 200 mm width provide ample coverage for various electronic assemblies. Made from ceramic filled silicone rubber, it balances flexibility with excellent thermal performance.
Operating temperature ranges from -50°C to a maximum of 180°C makes it suitable for harsh industrial and electronic environments, maintaining its integrity and thermal properties during continuous use. The Shore C hardness of 20 ensures a soft yet resilient contact surface for consistent thermal conduction.
Compliance with RoHS and REACH directives guarantees that this thermal gap pad meets stringent environmental and safety regulations, making it a reliable choice for modern electronics manufacturing and thermal management applications.
This product is widely used in industries such as industrial electronics, HVAC systems, manufacturing plants, and other settings requiring efficient thermal management solutions to protect sensitive electronic components from overheating.
The thermal pad measures 400 mm in length and 200 mm in width. Constructed from ceramic filled silicone rubber for excellent heat transfer. Operates reliably in temperature ranges from -50°C to 180°C. Shore C hardness rating of 20 ensures soft, compliant interface material.
Ideal for bridging air gaps and uneven surfaces between heatsinks and electronic devices. RoHS compliant and REACH approved, ensuring environmental safety. Light blue color enhances visual identification during installation.
The WE-TGF series offers durable and stable thermal interface solution for electronics cooling. Explore the Electronics Components category on EnvMart for more thermal management materials and products by Wurth Elektronik and other top brands.
Explore more products in our Thermal Pads category.
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Frequently Asked Questions
The thermal gap pad measures 400 mm in length and 200 mm in width.
This model has a thickness of 1 mm.
It has a thermal conductivity of 2 W/mK, allowing for efficient heat transfer.
The pad operates reliably in temperature ranges from -50°C to 180°C.
It is constructed from ceramic filled silicone rubber, which provides excellent heat transfer capabilities.
The hardness rating is Shore C 20, ensuring a soft and compliant interface material.
Yes, it is RoHS compliant and REACH approved, ensuring it meets environmental safety regulations.
The pad is light blue, which enhances visual identification during installation.
It is widely used in industrial electronics, HVAC systems, and manufacturing plants for efficient thermal management solutions.
It maintains its integrity and thermal properties during continuous use within its specified temperature range of -50°C to 180°C.
It is ideal for bridging air gaps and uneven surfaces between heatsinks and electronic devices.
Key features include its thickness of 1 mm, thermal conductivity of 2 W/mK, and compliance with RoHS and REACH standards.
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