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MBO Lead Solder Wire 1mm Diameter 38% Lead 60% Tin 2% Copper Flux Rosin 183°C SN60 PB CU2 10/10 - 3 CANAUX A11 - 500G
Specifications
| Country of Origin | France |
|---|---|
| Brand | MBO |
| Model | SN60 PB CU2 10/10 - 3 CANAUX A11 - 500G |
| Melting Point | 183°C |
| Product Weight | 500g |
| Wire Diameter | 1mm |
| Product Form | Wire |
| Percent Lead | 38% |
| Percent Tin | 60% |
| Flux Type | Rosin |
| Chlorine content | 1.1 % |
| Percent Copper | 2% |
| MBO Wire, 1 mm Lead Solder, 183 °C Melting PointBrand | MBO |
Key Features
- The wire contains 38% lead, 60% tin, and 2% copper, optimized for effective soldering performance.
- Incorporates a rosin flux type for excellent wetting and minimal residue during soldering.
- Designed for industrial applications including electronics and connector industries.
- Activated no-clean solder alloy ensures reduced fumes and cleaner finishing.
- Complies with J-STD-004 ROM1 classification for quality and reliability.
- Manufactured in France, guaranteeing high product standards.
- The product weight is 500 grams, providing ample supply for sustained use.
- Chlorine content is controlled at 1.1%, ensuring safety and compliance.
Product Description
MBO SN60 PB CU2 10/10 - 3 CANAUX A11 - 500G lead solder wire is a high-quality industrial solder wire with a 1mm diameter, composed of 38% lead, 60% tin, and 2% copper alloy designed for precise and reliable soldering applications. Its melting point of 183°C makes it ideal for a variety of electronics manufacturing and repair tasks.
This solder wire features a rosin flux, which promotes excellent wetting on tin-plated substrates and minimizes residue, making it especially suitable for sensitive electronic components. The activated no-clean alloy formulation reduces both fumes and residue, aiding in workplace safety and product cleanliness. It fully complies with the J-STD-004 ROM1 class standard, reflecting international quality criteria.
Manufactured in France, this product is trusted for its consistent chemical composition and performance, including a controlled chlorine content of 1.1%, which limits corrosive effects during soldering. Weighing 500 grams, this wire provides sufficient material for industrial and repair workshops.
Applications span industrial electronics, connector manufacturing, and precision soldering, where high reliability and quality consistency are paramount. This solder wire ensures strong and durable joints, maintaining electrical continuity and mechanical strength in various electronic assemblies.
The wire contains 38% lead, 60% tin, and 2% copper for optimal solder performance. It uses a rosin flux type to promote excellent wetting and minimal residue. Designed for industrial electronics and connector industry applications.
Activated no-clean alloy reduces fumes and leaves cleaner joints. Meets J-STD-004 ROM1 classification ensuring quality and reliability. Manufactured in France to high standards with controlled chlorine content. Weighs 500 grams, providing ample supply for industrial use.
Chlorine content maintained at 1.1% for compliance and safety.
Choose MBO Solder Wire for reliable and consistent soldering results in electronics manufacturing, repair, and connector production. Explore more from the Electronics Components category on EnvMart for quality industrial tools and materials.
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Frequently Asked Questions
The melting point of this solder wire is 183°C, making it suitable for various electronics manufacturing and repair tasks.
This solder wire is composed of 38% lead, 60% tin, and 2% copper, optimized for effective soldering performance.
The wire has a diameter of 1mm, which is a standard size for many soldering applications.
It uses a rosin flux type, which promotes excellent wetting and minimizes residue during soldering.
The product weighs 500 grams, providing ample supply for sustained use in industrial applications.
This solder wire is manufactured in France, ensuring high product standards.
The chlorine content is controlled at 1.1%, ensuring safety and compliance during soldering.
It is designed for industrial applications including electronics manufacturing and connector industries, where reliability is crucial.
Yes, it complies with the J-STD-004 ROM1 classification, reflecting international quality criteria.
The activated no-clean alloy formulation reduces fumes and leaves cleaner joints, aiding in workplace safety and product cleanliness.
The product form is wire, specifically designed for soldering applications.
The 38% lead content contributes to optimal solder performance, ensuring strong and durable joints in electronic assemblies.
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