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Felder Lottechnik Lead Free Solder Wire 1 mm Diameter, Rosin Based Flux, 217 °C Melting Point 40.841.020.1037
Specifications
| Country of Origin | Germany |
|---|---|
| Brand | Felder Lottechnik |
| Melting Point | 217°C |
| Product Weight | 250g |
| Wire Diameter | 1mm |
| Product Form | Wire |
| Percent Lead | 0% |
| Percent Silver | 3.8% |
| Percent Tin | 95.5% |
| Flux Type | Rosin Based |
| Percent Copper | 0.7% |
Key Features
- Lead free alloy composition with 0% lead content for safer soldering.
- Contains 95.5% tin, 3.8% silver, and 0.7% copper for reliable joint strength.
- Rosin based flux core ensures excellent solder flow and adhesion.
- Wire diameter of 1 mm suitable for various soldering tasks.
- Melting point of 217 °C provides consistent melting and solidification.
- Available in 250 g plastic coil packaging for convenient handling.
- Complies with DIN EN 29454 and EN 61190 standards.
- Manufactured in Germany ensuring high quality and reliability.
Product Description
Felder Lottechnik 40.841.020.1037 lead free solder wire features a 1 mm diameter wire made from a lead free alloy consisting of 95.5% tin, 3.8% silver, and 0.7% copper. It uses a rosin based flux core that facilitates excellent solder joint formation and adhesion, ideal for electronic manufacturing, repair, and assembly applications.
With a melting point of 217 °C, this solder wire ensures consistent melting characteristics suitable for precise soldering needs. The wire is offered in 250 g plastic coils which are easy to handle and store.
The product meets DIN EN 29454 and EN 61190 international standards, guaranteeing its compliance with quality and safety requirements. It is produced in Germany, reflecting the company's commitment to premium manufacturing quality.
This solder wire is suitable for industrial electronics, laboratory repairs, manufacturing, and precision electronic assembly work, especially where lead-free materials are mandatory for environmental and safety compliance.
Lead free alloy composition with zero lead content. 95.5% tin delivers optimal soldering performance. 3.8% silver enhances mechanical strength of solder joints. Rosin based flux ensures clean and reliable solder flow. Melting point of 217 °C for consistent soldering temperature control.
Suitable for electronic manufacturing, repair, and assembly. Complies with DIN EN 29454 and EN 61190 standards for electronics soldering materials. Explore more products in our Solder Wire category for diverse electronics assembly solutions at EnvMart.
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Frequently Asked Questions
The melting point of this solder wire is 217 °C, providing consistent melting characteristics for precise soldering tasks.
The solder wire consists of 95.5% tin, 3.8% silver, and 0.7% copper, ensuring reliable joint strength without lead content.
This solder wire has a diameter of 1 mm, making it suitable for a variety of soldering applications.
It uses a rosin based flux core, which facilitates excellent solder flow and adhesion for reliable joint formation.
The solder wire is packaged in a 250 g plastic coil, which is convenient for handling and storage.
This solder wire is manufactured in Germany, reflecting a commitment to high quality and reliability.
It complies with DIN EN 29454 and EN 61190 standards, ensuring adherence to quality and safety requirements for electronics soldering materials.
This solder wire is suitable for electronic manufacturing, repair, and assembly, particularly where lead-free materials are required.
The lead-free composition, with 0% lead content, makes it safer for use in electronic applications, aligning with environmental and safety regulations.
The 3.8% silver content enhances the mechanical strength of the solder joints, contributing to the reliability of the connections made.
The solder wire contains 0.7% copper, which contributes to the overall performance and characteristics of the solder joint.
Yes, this solder wire is designed for precision electronic assembly work, ensuring optimal soldering performance in such applications.
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