Multicore Lead Free Solder Wire 0.25 mm Diameter 217 °C Melting Point 250g Malaysia 737565

Multicore 737565 Lead Free Solder Wire with 0.25 mm diameter and a melting point of 217°C provides an effective solution for precise electronics soldering and assembly.

Composed of 95.5% tin, 3.8% silver, and 0.7% copper, this solder wire ensures excellent electrical conductivity and mechanical strength. The incorporated activated rosin flux facilitates smooth solder flow with minimal spatter and clean residues, enhancing solder joint quality.

This halide-free wire is supplied on a convenient spool weighing 250 grams, designed for controlled use in manufacturing environments. Its constant heat characteristics support high-speed soldering across a wide range of applications, including copper, brass, and nickel materials.

Certified to meet standards J-STD-004 and EN29453, this solder wire ensures compliance and reliability in industrial, electronics manufacturing, and laboratory environments. Its clear residue reduces cleanup time and improves safety in use.

The solder wire contains 95.5% tin, 3.8% silver, and 0.7% copper for excellent conductivity. It features an activated rosin flux incorporated into the wire for efficient soldering. This halide-free solder wire offers a low spatter and clean residue after soldering.

Its melting point of 217°C allows for consistent heat application and quick bonding. The wire is provided on a spool weighing 250 grams for easy handling and storage. Suitable for soldering copper, brass, and nickel components in industrial and electronics manufacturing.

Meets industry standards including J-STD-004 and EN29453 for quality and safety. Manufactured in Malaysia with high purity materials for reliable performance.

This Multicore lead free Solder Wire is essential for electronics production, assembly, repair, and prototyping applications. Browse the EnvMart catalog for more Multicore soldering materials and components optimized for reliability and consistency.