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MBO Lead Solder Wire 1.2 mm Diameter 183 °C Melting Point, 500g SN60 PB CU2 12/10 - 3 CANAUX A11 - 500G
Specifications
| Country of Origin | France |
|---|---|
| Brand | MBO |
| Model | SN60 PB CU2 12/10 - 3 CANAUX A11 - 500G |
| Melting Point | 183°C |
| Product Weight | 500g |
| Wire Diameter | 1.2mm |
| Product Form | Wire |
| Percent Lead | 38% |
| Percent Tin | 60% |
| Flux Type | Rosin |
| Chlorine content | 1.1 % |
| Percent Copper | 2% |
| MBO Wire, 1.5 mm Lead Solder, 183 °C Melting PointBrand | MBO |
Key Features
- The solder wire contains 60% tin, 38% lead, and 2% copper for optimal conductivity and mechanical strength.
- Incorporates a rosin flux type that ensures excellent wetting on tin-plated substrates.
- Generates minimal fumes and residue, contributing to a cleaner soldering environment.
- Chlorine content is low at 1.1%, satisfying J-STD-004 ROM1 class standards for solder quality.
- Manufactured in France, this solder wire is specialized for industrial electronics and connector use cases.
Product Description
MBO SN60 PB CU2 12/10 - 3 CANAUX A11 - 500G lead solder wire, 1.2 mm diameter, 183 °C melting point, and 500g weight, is a premium solder alloy designed for industrial electronics and connector industries.
This solder wire consists of 60% tin, 38% lead, and 2% copper, combined with an incorporated rosin flux to facilitate excellent wetting properties on tin-plated substrates. The activated no-clean alloy minimizes residue and fumes, ensuring a safer and cleaner working environment.
With a chlorine content of 1.1%, it meets J-STD-004 ROM1 class standards, indicating compliance with industrial soldering quality requirements. As a product manufactured in France, it delivers reliable and consistent performance in electronics manufacturing and repair.
The wire form factor and 1.2 mm diameter enable precise soldering applications, suitable for a wide range of industrial and commercial electronics assembly operations. The solder wire contains 60% tin, 38% lead, and 2% copper for balanced electrical and mechanical characteristics.
Rosin flux type ensures superior wetting and bonding to tin substrates. Minimal fumes and residues promote a healthier work environment. Low chlorine content at 1.1% enhances safety and compatibility with sensitive components.
Complies with J-STD-004 ROM1 classification for no-clean solder alloys.
This product is ideal for use in electronics manufacturing, connector assembly, repair shops, and industrial soldering operations requiring high reliability and clean solder joints.
Discover additional Solder Wires and related electronics components in the EnvMart catalog for your industrial and commercial needs.
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Frequently Asked Questions
The melting point of this solder wire is 183 °C.
This solder wire consists of 60% tin, 38% lead, and 2% copper.
The diameter of this solder wire is 1.2 mm.
The solder wire incorporates a rosin flux type, which ensures excellent wetting on tin-plated substrates.
The chlorine content of this solder wire is low at 1.1%.
This solder wire is manufactured in France.
The weight of this solder wire is 500 g.
This solder wire meets J-STD-004 ROM1 class standards for solder quality.
This solder wire is specialized for industrial electronics and connector use cases, making it suitable for electronics manufacturing and repair.
It generates minimal fumes and residue, contributing to a cleaner soldering environment.
The product form of this solder wire is wire.
The combination of 60% tin and 38% lead provides balanced electrical and mechanical characteristics for effective soldering.
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