MBO Lead Free Solder Wire Sn96.5 Ag3 Cu0.5 15/10 RT15, 1.5 mm Diameter, Rosin Flux, 217°C SN96.5 AG3 CU0.5 15/10 RT15 - 500G

MBO SN96.5 AG3 CU0.5 15/10 RT15 - 500G lead free solder wire is designed for precision soldering applications in electronics manufacturing and repair. The solder wire features a 1.5 mm diameter and a melting point of 217°C, offering excellent thermal control during soldering processes.

With a composition of 96.5% tin, 3% silver, and 0.5% copper, this rosin flux core solder wire delivers strong mechanical bonding and reliable electrical conductivity. It is formulated as a no-clean type, reducing the need for post-soldering cleaning and suitable for use on various substrates including sensitive surface mount devices.

This solder wire weighs 500 grams, making it practical for industrial scale use or extended repair jobs. The RT15 grade ensures fast wetting suitable for surface mount device repairs, while spools labeled A11 are utilized specifically for soldering connectors to diverse substrates.

Manufactured in France, the product complies with strict quality assurance protocols ensuring consistency and performance. This solder wire is widely used in industrial, electronics manufacturing, laboratory, and repair settings, improving solder joints' durability and reliability.

Contains 96.5% tin, 3% silver, and 0.5% copper composition. Utilizes rosin flux for effective soldering performance. Wire diameter is precisely 1.5 mm for versatile soldering applications. Product weight is 500 grams suitable for industrial and electronic repair needs.

Melting point of 217°C ensures controlled heat application and reduced damage. No-clean solder wire suitable for sensitive electronic substrates. Manufactured in France adhering to quality standards. Offers reliable wetting and flow for soldering connectors and SMD repairs.

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