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MBO Lead Free Solder Wire 1 mm Diameter, 217 °C Melting Point, Rosin Flux SN96.5 AG3 CU0.5 10/10 RT15 - 500G

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MBO Lead Free Solder Wire 1 mm Diameter, 217 °C Melting Point, Rosin Flux SN96.5 AG3 CU0.5 10/10 RT15 - 500G

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Category Solder Wire Brand MBO Condition New

Specifications

Country of Origin	France
Brand	MBO
Model	SN96.5 AG3 CU0.5 10/10 RT15 - 500G
Melting Point	217°C
Product Weight	500g
Wire Diameter	1mm
Product Form	Wire
Percent Lead	0%
Percent Silver	3%
Percent Tin	96.5%
Flux Type	Rosin
Percent Copper	0.5%
MBO Wire, 1.5 mm Lead Free Solder, 217 °C Melting PointBrand	MBO

Key Features

Composed of 96.5% tin, 3% silver, and 0.5% copper for reliable conductivity.
Lead-free formulation ensures environmental compliance and safety.
Rosin flux type facilitates effective solder joint formation.
Wire form factor with a diameter of 1 mm for precise soldering control.
Designed for use in electronics assembly, repairs, and manufacturing.
500 grams product weight providing sufficient material for medium scale jobs.
Melting point at 217 °C allows for controlled melting during soldering processes.
Manufactured in France ensuring quality standards.

Product Description

MBO SN96.5 AG3 CU0.5 10/10 RT15 - 500G lead free solder wire offers high-performance soldering with a 1 mm diameter and a melting point of 217 °C. Its composition of 96.5% tin, 3% silver, and 0.5% copper provides excellent electrical conductivity and mechanical strength, making it ideal for complex electronic applications.

This wire incorporates rosin flux, which helps in creating clean and reliable solder joints, reducing oxidation and improving wettability. Its lead-free formulation aligns with environmental regulations and promotes safer soldering processes.

The wire form factor with precise diameter measurement ensures optimal solder flow and control during assembly or repair tasks. The product weight of 500 grams is suitable for a variety of industrial and laboratory use cases.

Manufactured in France, this solder wire is produced under high-quality standards. It is suitable for surface-mount device (SMD) repairs and soldering connectors on various substrates, enhancing electronic manufacturing and maintenance processes.

Composed of 96.5% tin, 3% silver, and 0.5% copper for reliable conductivity. Lead-free formulation ensures environmental compliance and safety. Rosin flux type facilitates effective solder joint formation. Wire form factor with a diameter of 1 mm for precise soldering control.

Designed for use in electronics assembly, repairs, and manufacturing. 500 grams product weight providing sufficient material for medium scale jobs. Melting point at 217 °C allows for controlled melting during soldering processes.

Manufactured in France ensuring quality standards. Compatible with SMD repairs and connector soldering on various substrates.

This Solder Wire is ideal for industrial, manufacturing, laboratory, and electronics repair environments where reliable, lead-free solder is required. Explore more soldering wire options and related tools in the EnvMart soldering category for comprehensive solutions.