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Fischer Elektronik Heatsink, Universal Square Alu, Black Anodised Aluminium, Thermal Resistance 14.8K/W 12.3 ICK PGA 8x8x12
Specifications
| Country of Origin | Germany |
|---|---|
| Brand | Fischer Elektronik |
| Material | Aluminium |
| Colour | Black |
| Height | 12.3mm |
| Length | 23mm |
| Model | ICK PGA 8x8x12 |
| Finish | Black Anodised |
| Width | 23mm |
| Thermal Resistance | 14.8K/W |
| For Use With | Universal Square Alu |
| Fastening | Integrated clamp, Conductive Adhesive, Screw, Clamp, Thermally conductive adhesive, Glue |
| Compatible Package Type | PGA |
| AAVID THERMALLOY Heatsink, Universal Square Alu, 23.4K/W 18 mm 23 mm 23mmBrand | AAVID THERMALLOY |
Key Features
- Compatible with universal square aluminium packages.
- Multiple mounting options including integrated clamp, conductive adhesive, screws, clamps, and glue.
- Thermal resistance of 14.8K/W ensures effective heat dissipation.
- Black anodised aluminium finish offers durability and corrosion resistance.
- Suitable for PGA package types and semiconductor cooling applications.
- Manufactured in Germany with high-quality standards.
Product Description
Fischer Elektronik ICK PGA 8x8x12 heatsink is a high-performance cooling component ideal for electronics thermal management, particularly in industrial, laboratory, and semiconductor manufacturing environments.
This universal square aluminium heatsink features precise dimensions of 23 mm by 23 mm with a height of 12.3 mm and offers a thermal resistance of 14.8K/W, making it highly efficient for dissipating heat from integrated circuits, PGA packages, IC processors, and semiconductor devices.
The heatsink is constructed from premium aluminium material with a black anodised finish, providing excellent corrosion resistance, enhanced thermal conductivity, and long-term reliability. It can be securely mounted using a variety of fastening options including integrated clamps, conductive adhesives, screws, clamps, or glue according to application needs.
Designed for compatibility with PGA package types, this heatsink is well-suited for cooling microprocessors, PLCC, BGA components, power PCs, and other semiconductor processors. Its lightweight aluminium build helps maintain device performance without adding excessive weight.
Compatible with universal square aluminium packages. Dimensions: 23 mm length, 23 mm width, 12.3 mm height. Fastening options: integrated clamp, conductive adhesive, screw, clamp, glue. Thermal resistance: 14.8K/W for effective heat dissipation.
Black anodised aluminium for durability and thermal efficiency. PGA compatible package type. Manufactured in Germany ensuring high-quality standards.
This heatsink is essential for industrial electronics, power semiconductor cooling, HVAC, and electronic component manufacturing where reliable temperature control is critical. Enhance your thermal management solutions with Fischer Elektronik's trusted heatsink performance.
Browse more from the Heatsinks category at EnvMart for additional cooling and thermal management products from leading brands.
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Frequently Asked Questions
The thermal resistance of this heatsink is 14.8K/W, which ensures effective heat dissipation for various applications.
This model has dimensions of 23 mm in length, 23 mm in width, and a height of 12.3 mm.
It is constructed from aluminium with a black anodised finish, providing durability and corrosion resistance.
This heatsink is compatible with PGA package types, making it suitable for various semiconductor cooling applications.
It can be mounted using integrated clamps, conductive adhesive, screws, clamps, or glue, depending on the application needs.
This heatsink is manufactured in Germany, ensuring adherence to high-quality standards.
It is designed for use in industrial electronics, power semiconductor cooling, HVAC, and electronic component manufacturing.
The weight of this heatsink is not specified in the provided data.
The heatsink features a black anodised finish, which enhances its thermal efficiency and corrosion resistance.
Yes, it is well-suited for cooling microprocessors, PLCC, BGA components, and other semiconductor processors.
The thermal resistance rating of 14.8K/W indicates the efficiency of the heatsink in dissipating heat from electronic components, crucial for maintaining optimal performance.
Yes, the aluminium construction contributes to a lightweight design, helping to maintain device performance without adding excessive weight.
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