Samtec High Density Vertical Surface PCB Socket 20-Contact 4 Row 0.635mm Pitch 219V 1.34A ADF6

Samtec ADF6 series is a high density vertical surface PCB socket designed for applications requiring reliable board-to-board connectivity. Featuring 20 contacts arranged in 4 rows with a precise 0.635 mm pitch, this socket supports a maximum voltage of 219 volts and a current capacity of 1.34 amperes. The housing material is liquid crystal polymer, providing excellent mechanical stability and high temperature resistance.

This socket utilizes a solder termination type, ensuring strong mechanical and electrical bonds on the PCB. The stack height of 5 mm and vertical orientation make it suitable for space-constrained electronic assemblies. Contact plating of tin over nickel, enhanced with gold, assures corrosion resistance and optimum conductivity for sustained performance.

The Edge Rate® contact system is optimized to maintain signal integrity at extremely high speeds, suitable for data transmission rates up to 56 Gbps PAM4 or 28 Gbps NRZ applications. Its robust construction enables operation across a wide temperature range, from -55°C to 125°C, making it appropriate for industrial, telecommunications, and computing applications requiring durability under harsh conditions.

Manufactured in the United States, this Samtec PCB socket complies with strict environmental regulations, including EU RoHS, EU REACH, and China RoHS directives, ensuring it meets global standards for hazardous substances. Its compact size and four-row design make it ideal for use in high-density PCB layouts where space optimization without performance compromise is critical.

These features make the ADF6 PCB socket well-suited for industrial automation systems, data communication equipment, medical electronics, and test instrumentation where reliable and stable electrical connections are essential.

This PCB socket features a liquid crystal polymer housing for durability. It has a 5 mm stacking height and uses solder termination. The connector system is board-to-board with vertical orientation. Contact plating consists of tin over nickel and gold for reliable connections.

Operates over a wide temperature range from -55°C to 125°C. Complies with EU RoHS, EU REACH and China RoHS environmental standards. Optimized Edge Rate® contact system supports high-speed signal integrity applications. Designed for high density with 4 rows and 20 total contacts, suitable for compact PCB assemblies.

Manufactured in the United States ensuring quality and reliability.

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