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MBO Lead Solder Wire 0.7mm Diameter 500g Rosin Flux Activated No-Clean Alloy SN60 PB CU2 7/10 - 3 CANAUX A11 - 500G
Specifications
| Country of Origin | France |
|---|---|
| Brand | MBO |
| Model | SN60 PB CU2 7/10 - 3 CANAUX A11 - 500G |
| Melting Point | 183°C |
| Product Weight | 500g |
| Wire Diameter | 0.7mm |
| Product Form | Wire |
| Percent Lead | 38% |
| Percent Tin | 60% |
| Flux Type | Rosin |
| Chlorine content | 1.1 % |
| Percent Copper | 2% |
| MBO Wire, 1 mm Lead Solder, 183 °C Melting PointBrand | MBO |
Key Features
- Activated no-clean solder alloy with incorporated resinous flux for superior soldering results.
- Wire diameter of 0.7 mm ensuring precise solder application.
- Contains 60% tin, 38% lead, and 2% copper for optimal mechanical and electrical properties.
- Rosin flux type providing excellent wetting on tin-plated substrates.
- Generates minimal fumes and residue, suitable for electronics and connector industries.
- Complies with Class J-STD-004 ROM1 standards for flux performance.
- Chlorine content maintained at 1.1% to balance flux activity and residue.
- Product weight of 500 grams, packaged for industrial use.
Product Description
MBO SN60 PB CU2 7/10 - 3 CANAUX A11 - 500G lead solder wire features a 0.7 mm wire diameter and a melting point of 183°C, formulated specifically for industrial applications in electronics and connector manufacturing.
This solder wire utilizes an activated no-clean alloy with incorporated resinous flux, enhancing solder joint reliability and promoting excellent wetting on tin-plated substrates. It generates minimal fumes and residue, making it suitable for controlled manufacturing environments.
The alloy composition includes 60% tin, 38% lead, and 2% copper, providing an ideal balance of mechanical strength, electrical conductivity, and melting characteristics. The included rosin flux complies with Class J-STD-004 ROM1, ensuring consistent performance during soldering operations.
With a chlorine content of 1.1%, the solder wire maintains effective flux activity without excessive residue formation, supporting post-solder cleaning processes. Weighing 500 grams, this product is ergonomically packaged for ease of use in production settings.
Manufactured in France under strict quality systems, the product meets industrial standards and is designed for use in electronics, HVAC, manufacturing, and other precision soldering tasks requiring reliable and efficient solder joints.
Activated no-clean solder alloy with resinous flux integrated. Precise 0.7 mm wire diameter for controlled solder flow. Alloy composition: 60% tin, 38% lead, 2% copper for optimal properties. Rosin flux type provides excellent wetting on tin-plated substrates.
Minimal fumes and residue enhance production environment safety. Class J-STD-004 ROM1 compliant flux ensuring reliable soldering. Chlorine content at 1.1% supporting effective flux activity. 500 grams weight suitable for industrial use and storage.
Origin: France, guaranteeing rigorous quality standards. Explore further in the Electronics & Electricals category for related Solder Wires and accessories on EnvMart.
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Frequently Asked Questions
The solder wire has a diameter of 0.7 mm, ensuring precise solder application.
This model has a melting point of 183°C, suitable for various soldering applications.
The alloy consists of 60% tin, 38% lead, and 2% copper, providing optimal mechanical and electrical properties.
It utilizes a rosin flux type, which provides excellent wetting on tin-plated substrates and generates minimal fumes and residue.
The chlorine content is maintained at 1.1%, balancing flux activity and residue formation.
The product weighs 500 grams, making it suitable for industrial use and storage.
It is manufactured in France, adhering to strict quality systems.
Yes, it is designed for use in electronics, HVAC, manufacturing, and other precision soldering tasks.
The included rosin flux complies with Class J-STD-004 ROM1 standards for flux performance.
The solder wire is ergonomically packaged for ease of use in production settings.
This solder wire is intended for industrial applications in electronics and connector manufacturing.
The activated no-clean alloy enhances solder joint reliability and promotes excellent wetting on substrates, making it suitable for controlled manufacturing environments.
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