Samtec ERF8 Series Vertical Surface PCB Socket 120-Contact 2 Row 0.8 mm Pitch Solder ERF8

The Samtec ERF8 Series vertical surface PCB socket model ERF8-060-07.0-L-DV-TR is engineered for high-speed data and power board-to-board connections. It features 120 gold-plated beryllium copper alloy contacts in a two-row vertical configuration optimized for fast signal transmission at rates up to 56Gbps PAM4.

This surface mounted socket has a pitch of 0.8 mm and stacking height of 18 mm, making it suitable for compact and high-density PCB designs. The housing is made from liquid crystal polymer, providing excellent mechanical strength and thermal stability within a wide temperature range of -55°C to 125°C.

Designed with solder termination and a rated current of 2.2A along with a voltage rating of 318V, this PCB socket supports robust electrical performance for industrial, telecommunications, and computing applications.

The connector system enables secure board-to-board stacking with reliable electrical contact and long-lasting durability, benefiting from gold plating for corrosion resistance and enhanced conductivity.

This component is ideal for industrial electronics manufacturing, high-speed computing systems, data centers, and telecommunications equipment requiring precise and reliable interconnections.

High-speed vertical surface PCB socket with 120 gold-plated contacts. Robust housing material offering thermal and mechanical resistance. Wide operating temperature range ensures performance under harsh conditions. Supports high data rates suitable for modern industrial and telecom applications.

Surface mount design for compact PCB assembly. Explore related products and components in the PCB Sockets category for complementary solutions and system integration.