CIF 2 Photoresist Board Epoxy Glass Fabric Laminate, 160 mm Length With 35 μm Copper Thickness, 0.4 mm Width ABC16

The CIF ABC16 photoresist board is a high-quality epoxy glass fabric laminate designed for prototyping electronic circuits and other precision applications. Featuring a board thickness of 0.4 mm and copper thickness of 35 μm on both sides, this 2-sided board ensures excellent conductivity and durability.

Measuring 160 mm in length and 0.4 mm in width, the board suits a range of PCB prototyping needs with precise dimensional stability. The FR4 material grade provides enhanced mechanical strength and thermal resistance, and it complies with military standard 113949 F, ensuring reliable performance.

Additionally, the board offers UL 94-V0 fire resistance, adding a safety layer essential for electronic component fabrication and industrial uses. The recommended developer concentration involves using sachet 160-9490 or 6-10 g/l of sodium or potassium hydroxide, with trials advised to optimize processing conditions.

This board is manufactured in France, which guarantees adherence to strict quality control and material standards. It is ideal for applications in electronics prototyping, cleanroom manufacturing, industrial design, and laboratory settings where precision and reliability are critical.

Constructed with a 2-sided epoxy glass fabric laminate board for durability. Features a copper thickness of 35 micrometers for reliable conductivity. Board dimensions include 160 mm length and 0.4 mm width for precision design.

Board thickness measured at 0.4 mm to provide stable structural integrity. Complies with military standard 113949 F and has fire resistance rating UL 94-V0. Recommended developer concentration uses sachet 160-9490 or 6-10 g/l sodium or potassium hydroxide.

Manufactured in France ensuring quality material standards. Explore more in the Copper Clad Boards category for a wide range of prototyping solutions, industrial supplies, and electronic fabrication materials at EnvMart.