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| Country of Origin | Japan |
|---|---|
| Brand | Sunhayato |
| Length | 100mm |
| Model | 12 |
| Board Material | Synthetic Resin Bonded Paper |
| Number of Sides | 1 |
| Board Thickness | 1.6mm |
| FR Material Grade | FR1 |
| Copper Thickness | 35μm |
Sunhayato 12 Copper Clad Board Synthetic Resin Bonded Paper is a high-quality electronic prototyping board constructed with one side copper clad and synthetic resin bonded paper, providing excellent mechanical and electrical properties. The copper thickness of 35 μm ensures good electrical conductivity for circuit layouts and connections.
This copper clad board utilizes FR1 material grade, a flame retardant phenolic resin bonded paper, with a board thickness of 1.6 mm, offering durability and adequate insulation. The board length measures 100 mm, making it convenient for electronic experiments and PCB prototyping tasks.
Manufactured in Japan, it meets consistent quality standards for professional and hobbyist electronic engineers. The board is especially suited for creating custom circuits, small batch PCB manufacturing, and educational applications requiring reliable copper surfaces and insulation.
Key features include synthetic resin bonded paper substrate, a single copper clad side with 35 μm thickness, and flame retardant FR1 material. These properties contribute to safety, ease of soldering, and stability during electrical testing.
The material is synthetic resin bonded paper for durability and insulation. One side clad with 35 μm thick copper provides conductive surface. FR1 flame retardant rating enhances safety for lab and industrial use. 1.6 mm thickness ensures sturdy support for components and circuits.
100 mm length is compatible with standard prototyping board sizes. Originating from Japan with strict manufacturing controls for quality. Suitable for laboratory, educational, industrial prototyping, and repair tasks. Explore more Copper Clad Boards and prototyping supplies in the Electronics Components category at EnvMart to support your development projects and manufacturing needs.
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