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CIF Flexible Copper Clad Board Epoxy Glass Fabric Laminate 35μm Copper Thickness 0.05mm Board Thickness 600mm Length AN10
Specifications
| Country of Origin | France |
|---|---|
| Brand | CIF |
| Length | 600mm |
| Model | AN10 |
| Board Material | Epoxy Glass Fabric Laminate |
| Number of Sides | 1 |
| Board Thickness | 0.05mm |
| FR Material Grade | FR4 |
| Copper Thickness | 35μm |
Key Features
- This board is made from epoxy glass fabric laminate offering excellent insulation and mechanical strength.
- Features a single copper-clad side with a thickness of 35 micrometers for optimal conductivity.
- Extremely thin board thickness of 0.05mm ensures flexibility and adaptability in design.
- Measured length is 600mm, suitable for various prototyping and electronic applications.
- Crafted to FR4 grade material standards providing flame resistance and durability.
- Manufactured in France ensuring quality compliance and reliability.
Product Description
The CIF AN10 model flexible copper clad board is a single-sided printed circuit board constructed from high-quality epoxy glass fabric laminate. It includes a 35μm thick copper layer coating one side, ideal for circuit prototyping and flexible electronic applications requiring thin and reliable copper surfaces.
This board is notably thin, with a thickness of only 0.05mm, which enhances its flexibility and adaptability for compact or curved electronic designs.
It conforms to FR4 flame retardant material grade ensuring safety and durability during usage in industrial electronics environments. The length of 600mm supports a wide range of design requirements from simple to complex circuits.
Manufactured in France, the CIF AN10 flexible copper clad board undergoes stringent quality controls to meet industrial standards for electronic component manufacturing. Flexible and single-sided copper clad laminate ensures versatile applications.
Epoxy glass fabric offers high insulation and mechanical strength. 35μm thick copper layer provides excellent conductivity. Board thickness of 0.05mm supports flexible designs. 600mm length fits standard prototype specifications.
FR4 grade flame retardant material ensures safety. Made in France guaranteeing compliance and quality.
This copper clad board is highly suitable for electronic component prototyping, DIY electronics projects, and industrial applications involving flexible printed circuit boards. Its excellent material quality and precise copper thickness make it optimal for professional use in manufacturing and repair workshops.
Explore a wide selection of electronic components and prototyping boards on EnvMart to complement the CIF AN10 flexible copper clad board for your industrial and laboratory needs.
Explore more products in our Copper Clad Boards category.
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Frequently Asked Questions
The CIF AN10 flexible copper clad board measures 600mm in length, making it suitable for various prototyping and electronic applications.
The board has a thickness of 0.05mm, which enhances its flexibility and adaptability for compact electronic designs.
This board is constructed from epoxy glass fabric laminate, providing excellent insulation and mechanical strength.
The CIF AN10 features a copper thickness of 35μm on one side, ensuring optimal conductivity for electronic applications.
This model is a single-sided copper clad board, which is ideal for specific circuit prototyping needs.
The board conforms to FR4 grade material standards, ensuring flame resistance and durability during usage in industrial electronics environments.
It is manufactured in France, which guarantees compliance with quality standards for electronic components.
This board is highly suitable for electronic component prototyping, DIY electronics projects, and industrial applications involving flexible printed circuit boards.
The epoxy glass fabric laminate used in this board offers high insulation and mechanical strength, making it suitable for various electronic applications.
The extremely thin design of 0.05mm supports flexible and compact electronic designs, allowing for adaptability in various applications.
Projects that require thin and reliable copper surfaces, such as circuit prototyping and flexible electronic applications, can benefit from this board.
The 35μm thick copper layer provides excellent conductivity, which is critical for the performance of electronic circuits.
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