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| Country of Origin | India |
|---|---|
| Brand | Infineon |
| Model | IDDD20G65C6XTMA1 |
| Mount Type | Surface |
| Series | IDDD20G65C6 |
| Maximum Operating Temperature | 175°C |
| Package Type | TO-263 |
| Minimum Operating Temperature | -55°C |
| Standards/Approvals | JEDEC (J-STD20 and JESD22) |
| Pin Count | 10 |
| Maximum Continuous Forward Current If | 20A |
| Peak Reverse Repetitive Voltage Vrrm | 650V |
| Rectifier Type | Schottky |
| Peak Reverse Current Ir | 2μA |
| Peak Non-Repetitive Forward Surge Current Ifsm | 99A |
| Maximum Forward Voltage Vf | 1.25V |
Infineon IDDD20G65C6XTMA1 is a Schottky Barrier Diode designed for high power and high efficiency applications. Featuring a surface mount TO-263 10-pin Double DPAK package, this diode delivers a maximum continuous forward current of 20 A and peak reverse repetitive voltage of 650 V, making it suitable for robust power electronics functions.
The diode supports a wide operating temperature range from -55°C to 175°C and has a maximum forward voltage drop of 1.25 V, ensuring reduced power dissipation and improved energy efficiency in circuits. It exhibits a very low peak reverse current of 2 µA, reducing leakage and enhancing device reliability.
The device complies with JEDEC standards J-STD20 and JESD22, guaranteeing quality and endurance under industrial conditions. Its 10-pin DDPAK package facilitates top-side cooling, providing optimal thermal management during operation.
This Schottky diode is ideal for use in industrial and commercial applications such as power supply units in PCs, solar energy converters, telecommunications infrastructure, and server power systems.
Equipped with a surface mount TO-263 package suitable for automated assembly. Maximum continuous forward current of 20 A. Peak reverse repetitive voltage of 650 V. Peak non-repetitive forward surge current of 99 A. Extensive operating temperature range from -55°C up to 175°C.
Low forward voltage (1.25 V) contributing to efficiency. Minimal peak reverse current of 2 µA. Compliance with JEDEC standards for reliability. Top-side cooling via Double DPAK package. Widely applicable in power electronics for industrial and commercial use.
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