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onsemi Serdes IC 28 LVTTL LVDS 56-Pin TSSOP FIN3385MTDX

Category LVDS Interface Ics Brand onsemi Condition New

Specifications

Country of Origin India
Brand onsemi
Height 1mm
Length 14mm
Model FIN3385MTDX
Mount Type Surface
Output type LVDS
Series FIN3385
Input Type LVTTL
Maximum Operating Temperature 85°C
Package Type TSSOP
Sub Type Serdes
Minimum Operating Temperature -40°C
Pin Count 56
Number of Elements per Chip 4
Maximum Supply Voltage 3.6V
Minimum Supply Voltage 3V
Number of Drivers 28
Number of Receivers 28
Transmission Data Rate 2.38Gbps
Differential Input High Threshold Voltage 100mV
Differential Input Low Threshold Voltage -100mV

Key Features

  • Supports data transmission rates up to 2.38 Gbps.
  • Features 28 drivers and 28 receivers for balanced signal processing.
  • Low voltage differential signaling output ensures reduced noise and power consumption.
  • Operating voltage range from 3 V to 3.6 V suitable for various applications.
  • Temperature range from -40°C to 85°C allows for robust industrial use.
  • Surface mount technology with a TSSOP package type for compact PCB integration.
  • Provides electrostatic discharge protection for enhanced durability.
  • Compact dimensions with 14 mm length and 1 mm height optimize board space.

Product Description

onsemi FIN3385MTDX Serdes IC is a high-performance interface chip featuring 28 LVTTL inputs and 28 LVDS outputs in a compact 56-pin TSSOP surface mount package. It supports differential signaling at data rates up to 2.38 Gbps, enabling high-speed digital communication for various electronic systems.

This device operates efficiently within a supply voltage range of 3 V to 3.6 V, suitable for modern low-voltage applications. It is designed to withstand industrial temperature variations from -40°C to 85°C, ensuring reliability under harsh conditions. The differential input high and low threshold voltages are ±100 mV, supporting robust signal integrity.

Its electrostatic discharge protection enhances circuit durability, making the FIN3385MTDX ideal for environments where ESD events are likely. The 56-pin thin shrink small outline package (TSSOP) facilitates compact and streamlined PCB design, conserving valuable board space.

Commonly used in electronic communication interfaces such as Firewire, SATA, and SCSI, this Serdes IC is crucial for applications requiring efficient low-voltage differential signaling (LVDS). It enables fast, low-noise data transmission over twisted-pair copper cables, widely used in industrial, commercial, and computing hardware.

Supports data transmission rates up to 2.38 Gbps. Includes 28 drivers and 28 receivers for balanced signal management. Operates with supply voltages between 3 V and 3.6 V. Designed for operating temperatures from -40°C to 85°C.

Equipped with ESD protection for enhanced reliability. Surface mount TSSOP package optimizes PCB space. Compact physical size with 14 mm length and 1 mm height. Suitable for industrial and commercial electronics applications.

This product belongs to the semiconductor category specializing in LVDS interface ICs. Its robust electrical and physical characteristics make it an excellent choice for designers seeking reliable, high-speed Serdes solutions.

Explore more on LVDS Interface Ics and other semiconductors at EnvMart for comprehensive product selections and technical support.

onsemi Serdes IC 28 LVTTL LVDS 56-Pin TSSOP FIN3385MTDX
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Frequently Asked Questions

It supports data transmission rates up to 2.38 Gbps, enabling high-speed digital communication.

This model operates within a supply voltage range of 3 V to 3.6 V, suitable for low-voltage applications.

It is designed to function effectively in temperatures ranging from -40°C to 85°C, making it suitable for industrial environments.

The FIN3385MTDX features 28 drivers and 28 receivers, allowing for balanced signal processing.

It is packaged in a 56-pin TSSOP (Thin Shrink Small Outline Package), which is suitable for surface mount technology.

This Serdes IC utilizes low voltage differential signaling (LVDS) output, which helps reduce noise and power consumption.

The compact dimensions of this model are 14 mm in length and 1 mm in height, optimizing board space.

Yes, it is equipped with electrostatic discharge (ESD) protection, enhancing its durability in environments prone to ESD events.

The differential input high threshold voltage is ±100 mV, which supports robust signal integrity.

It is commonly used in electronic communication interfaces such as Firewire, SATA, and SCSI, which require efficient LVDS.

This product is manufactured in India.

The FIN3385MTDX consists of 4 elements per chip, contributing to its functionality.

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