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Winbond Mobile LPDDR SDRAM 512 MB Surface Mount, 60-Pin 16 bit VFBGA W949D6DBHX5I

Category Memory Chips Brand Winbond Condition New

Specifications

Country of Origin India
Brand Winbond
Height 650μm
Length 9.1mm
Model W949D6DBHX5I
Width 8.1mm
Mount Type Surface
Series W949D6DB
Maximum Operating Temperature 85°C
Package Type VFBGA
Minimum Operating Temperature -40°C
Memory size 512MB
Standards/Approvals LVCMOS Compatible
Pin Count 60
Maximum Supply Voltage 1.95V
Minimum Supply Voltage 1.7V
Maximum Clock Frequency 200MHz
Organisation 64M x 8 Bit
Number of Bits per Word 8
Maximum Random Access Time 5ns
Number of Words 64M
Burst Type Sequential or Interleave

Key Features

  • Memory size of 512MB suitable for mobile devices.
  • Operates with a maximum clock frequency of 200MHz providing efficient data processing.
  • Surface mount type with a compact 60-pin VFBGA package.
  • Supports burst type sequential or interleave for optimal memory access.
  • Operating temperature range from -40°C to 85°C for versatile environmental performance.
  • Includes power-saving modes such as PASR, ATCSR, and Power Down Mode for energy efficiency.
  • Compatible with LVCMOS standards for interface compatibility.

Product Description

Winbond W949D6DBHX5I is a Mobile LPDDR SDRAM memory chip featuring 512 MB memory size designed for low power and high performance applications. This memory module is mounted on surface with a 60-pin 16 bit VFBGA package, providing a compact and reliable solution for mobile and embedded systems.

Operating at a maximum clock frequency of 200MHz, it offers efficient data handling and fast access times with a maximum random access time of 5ns. The chip is organized as 4M words by 4 banks by 16 bits, capable of supporting bidirectional data strobe (DQS) for precise data transmission and receipt. It supports burst types, either sequential or interleave, allowing for flexible data burst handling.

Designed with power efficiency in mind, the memory chip supports standard self-refresh modes such as PASR and ATCSR along with power down mode, which help in reducing power consumption in mobile devices. The supply voltage ranges between 1.7V and 1.95V.

This module supports a wide operating temperature range from -40°C to 85°C, making it suitable for various industrial, commercial, and mobile environments. Its compact dimensions of 9.1 mm length, 8.1 mm width, and 650 μm height facilitate space-saving integration on PCB assemblies.

The W949D6DBHX5I complies with LVCMOS compatible standards, ensuring easy interfacing with other digital components. It does not meet automotive standards, thus it is primarily intended for consumer and industrial electronic products rather than automotive applications.

Memory size of 512 MB ensures adequate space for mobile applications. Maximum clock frequency of 200 MHz supports fast data processing. Surface Mount Technology (SMT) with 60-pin VFBGA package for compact mounting. Supports sequential and interleave burst types for optimized performance.

Wide operating temperature range ensures reliability in diverse environments. Low power consumption with supply voltage between 1.7V and 1.95V. Power-saving modes like PASR, ATCSR, and Power Down reduce energy use. Physical dimensions suitable for compact, space-sensitive devices.

Compatible with LVCMOS standard for seamless integration.

This Winbond mobile LPDDR SDRAM memory chip is ideal for a variety of electronic and semiconductor applications including consumer electronics, embedded systems, and mobile computing.

Explore the full range of Memory Chips and semiconductors on EnvMart for high-performance electronic components.

Winbond Mobile LPDDR SDRAM 512 MB Surface Mount, 60-Pin 16 bit VFBGA W949D6DBHX5I
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Frequently Asked Questions

The memory size of this model is 512 MB, suitable for mobile devices.

It operates with a maximum clock frequency of 200 MHz, providing efficient data processing.

This model has dimensions of 9.1 mm in length, 8.1 mm in width, and a height of 650 μm.

The memory chip is packaged in a 60-pin VFBGA (Very Fine Ball Grid Array) configuration, suitable for surface mounting.

It has an operating temperature range from -40°C to 85°C, making it versatile for various environments.

The supply voltage for this memory chip ranges between 1.7V and 1.95V.

It supports burst types of either sequential or interleave for optimized memory access.

The maximum random access time is 5 ns, allowing for fast data access.

Yes, it complies with LVCMOS standards, ensuring compatibility with other digital components.

It includes power-saving modes such as PASR, ATCSR, and Power Down Mode to enhance energy efficiency.

The chip is organized as 64M words by 8 bits, allowing for efficient data handling.

The country of origin for this model is India.

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