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| Country of Origin | India |
|---|---|
| Brand | Winbond |
| Height | 650μm |
| Length | 9.1mm |
| Model | W949D6DBHX5I |
| Width | 8.1mm |
| Mount Type | Surface |
| Series | W949D6DB |
| Maximum Operating Temperature | 85°C |
| Package Type | VFBGA |
| Minimum Operating Temperature | -40°C |
| Memory size | 512MB |
| Standards/Approvals | LVCMOS Compatible |
| Pin Count | 60 |
| Maximum Supply Voltage | 1.95V |
| Minimum Supply Voltage | 1.7V |
| Maximum Clock Frequency | 200MHz |
| Organisation | 64M x 8 Bit |
| Number of Bits per Word | 8 |
| Maximum Random Access Time | 5ns |
| Number of Words | 64M |
| Burst Type | Sequential or Interleave |
Winbond W949D6DBHX5I is a Mobile LPDDR SDRAM memory chip featuring 512 MB memory size designed for low power and high performance applications. This memory module is mounted on surface with a 60-pin 16 bit VFBGA package, providing a compact and reliable solution for mobile and embedded systems.
Operating at a maximum clock frequency of 200MHz, it offers efficient data handling and fast access times with a maximum random access time of 5ns. The chip is organized as 4M words by 4 banks by 16 bits, capable of supporting bidirectional data strobe (DQS) for precise data transmission and receipt. It supports burst types, either sequential or interleave, allowing for flexible data burst handling.
Designed with power efficiency in mind, the memory chip supports standard self-refresh modes such as PASR and ATCSR along with power down mode, which help in reducing power consumption in mobile devices. The supply voltage ranges between 1.7V and 1.95V.
This module supports a wide operating temperature range from -40°C to 85°C, making it suitable for various industrial, commercial, and mobile environments. Its compact dimensions of 9.1 mm length, 8.1 mm width, and 650 μm height facilitate space-saving integration on PCB assemblies.
The W949D6DBHX5I complies with LVCMOS compatible standards, ensuring easy interfacing with other digital components. It does not meet automotive standards, thus it is primarily intended for consumer and industrial electronic products rather than automotive applications.
Memory size of 512 MB ensures adequate space for mobile applications. Maximum clock frequency of 200 MHz supports fast data processing. Surface Mount Technology (SMT) with 60-pin VFBGA package for compact mounting. Supports sequential and interleave burst types for optimized performance.
Wide operating temperature range ensures reliability in diverse environments. Low power consumption with supply voltage between 1.7V and 1.95V. Power-saving modes like PASR, ATCSR, and Power Down reduce energy use. Physical dimensions suitable for compact, space-sensitive devices.
Compatible with LVCMOS standard for seamless integration.
This Winbond mobile LPDDR SDRAM memory chip is ideal for a variety of electronic and semiconductor applications including consumer electronics, embedded systems, and mobile computing.
Explore the full range of Memory Chips and semiconductors on EnvMart for high-performance electronic components.
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