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| Country of Origin | India |
|---|---|
| Brand | Winbond |
| Height | 600μm |
| Length | 11.1mm |
| Cell Type | SLC NAND |
| Model | W29N01HZBINA |
| Width | 11.1mm |
| Mount Type | Surface |
| Density | 1Gbit (Single chip solution) |
| Series | W29N01HZ |
| Industrial | -40°C to 85°C |
| Maximum Operating Temperature | 85°C |
| Package Type | VFBGA |
| Minimum Operating Temperature | -40°C |
| Memory size | 1GB |
| Interface Type | Parallel |
| Pin Count | 63 |
| Maximum Supply Voltage | 1.95V |
| Minimum Supply Voltage | 1.7V |
| Supply Current | 25mA |
| Organisation | 128M x 8 Bit |
| Number of Bits per Word | 8 |
| Maximum Random Access Time | 25μs |
| Number of Words | 128M |
| Bus Width | x8 x16 |
| Vcc | 1.7V to 1.95V |
| Random read | 25us |
| Sequential read cycle | 25ns |
| Page program time | 250us(typ.) |
| Block erase time | 2ms(typ.) |
| Read | 13 mA(typ.) |
| Program/Erase | 10mA(typ) |
| CMOS standby | 10uA(typ.) |
Winbond W29N01HZBINA is a high-performance Single-Level Cell (SLC) NAND flash memory component designed for industrial and commercial electronic applications. It features a 1 GB memory size organized as 128M x 8 bit, providing reliable storage capacity in a compact VFBGA package that supports a 63-pin parallel interface.
Operating over a voltage range of 1.7V to 1.95V and functioning in temperature extremes from -40°C to 85°C, this module is suitable for harsh environmental conditions often encountered in industrial, manufacturing, and automation systems.
The device supports fast random and sequential access with a random read time of 25 µs and sequential read cycles as low as 25 ns. Program and erase operations are optimized for quick performance with typical page program times of 250 µs and block erase times of 2 ms.
Built on SLC NAND technology, the flash memory supports 100,000 erase/program cycles ensuring durability and a decade-long data retention period, making it ideal for long-term embedded memory storage needs.
Power efficiency is key with this flash memory, consuming typically 13 mA during read operations, 10 mA during program/erase cycles, and as low as 10 µA in CMOS standby mode, aiding in low-power embedded system designs.
Its compact footprint with dimensions 11.1 mm x 11.1 mm and a height of 600 µm allows integration into space-constrained PCB layouts. The surface mount VFBGA packaging provides secure mounting and reliable connection integrity for demanding electronic applications.
Winbond W29N01HZBINA flash memory is ideal for use in industrial automation, embedded systems, communication devices, and other semiconductor memory applications requiring robust performance and endurance.
Utilizes Single-Level Cell (SLC) NAND technology for maximum reliability. Memory density of 1 Gbit organized as 128M words x 8 bits. Operates under a 63-pin Very Fine Ball Grid Array (VFBGA) surface mount package. Industrial operating temperature range from -40°C to 85°C.
Low power consumption for efficient embedded system design. Fast random and sequential read access times. High endurance and data retention suitable for industrial use. Supports standard NAND command sets and additional copy-back command.
Compact chip size enabling integration in tight electronic assemblies. Designed for applications in industrial, communication, and embedded memory systems. Browse our extensive selection of semiconductor Flash Memory components at EnvMart for industrial-grade solutions.
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