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| Country of Origin | India |
|---|---|
| Brand | TE Connectivity |
| Orientation | Vertical |
| Current | 3A |
| Frame Type | Open Frame |
| Length | 10.16mm |
| Depth | 10.16mm |
| Width | 4.57mm |
| Mount Type | Through Hole |
| Housing Material | Polycyclohexylenedimethylene Terephthalate |
| Contact Material | Beryllium Copper Alloy |
| Series | DIPLOMATE 800 |
| Termination Type | Solder |
| Maximum Operating Temperature | 105°C |
| Minimum Operating Temperature | -55°C |
| Pitch | 2.54mm |
| Contact Plating | Tin, Gold |
| Number of Contacts | 8 |
| Pin Type | Turned |
| Row Width | 7.62mm |
TE Connectivity 2-1571586-2 is a high-quality DIPLOMATE 800 series open frame DIL socket designed for vertical mounting on PCBs. It features 8 contacts arranged with a 2.54 mm pitch and a row width of 7.62 mm, optimized for through hole soldering processes in electronic assembly.
This socket supports currents up to 3A with turned pin contacts made from beryllium copper alloy, ensuring reliable electrical connectivity. The contacts are plated with tin and gold to enhance corrosion resistance and longevity of the connection.
The housing is constructed from Polycyclohexylenedimethylene Terephthalate, which is rated UL 94V-0 for flame retardancy, providing safety and durability even under elevated temperatures up to 105°C. Its minimum operating temperature rating of -55°C makes it suitable for a variety of industrial and commercial electronic applications.
With a compact size of 10.16 mm in length and depth and 4.57 mm width, this open frame socket allows for efficient use of PCB area. The vertical orientation and standard ladder-style design are ideal for mounting integrated circuits and adapters in computing, communications, and control equipment.
The DIPLOMATE 800 series ensures high performance for IC socket needs. Contact plating of tin and gold maintains electrical integrity and prevents oxidation. Through hole mounting improves mechanical stability on printed circuit boards.
Open frame construction reduces material usage while preserving strength. Robust operating temperature range suits diverse environmental conditions. Beryllium copper alloy contacts offer excellent conductivity and spring properties.
Standard 2.54 mm pitch matches common IC package sizes. Compatible with solder termination for secure PCB integration.
This product is ideal for industrial electronics manufacturing, repair, prototyping, and laboratory use where reliable and standard-compliant socketing solutions are required. Its open frame design caters to high-density applications requiring dependable IC connections.
Explore EnvMart's extensive range of DIL Sockets and TE Connectivity products for trusted industrial electronic components suitable for a broad spectrum of professional applications.
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