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TE Connectivity DIPLOMATE 800 Vertical 8 Way Through Hole Turned Pin Open Frame DIL Socket 2.54 mm Pitch 3A 2-1571586-2

Category DIL Socket Brand TE Connectivity Condition New

Specifications

Country of Origin India
Brand TE Connectivity
Orientation Vertical
Current 3A
Frame Type Open Frame
Length 10.16mm
Depth 10.16mm
Width 4.57mm
Mount Type Through Hole
Housing Material Polycyclohexylenedimethylene Terephthalate
Contact Material Beryllium Copper Alloy
Series DIPLOMATE 800
Termination Type Solder
Maximum Operating Temperature 105°C
Minimum Operating Temperature -55°C
Pitch 2.54mm
Contact Plating Tin, Gold
Number of Contacts 8
Pin Type Turned
Row Width 7.62mm

Key Features

  • The socket features an open frame DIPLOMATE 800 series design for reliable PCB mounting.
  • Turned pins provide durable solder connections through the PCB.
  • Contact plating includes tin and gold for corrosion resistance.
  • The housing material is Polycyclohexylenedimethylene Terephthalate with UL 94V-0 rating.
  • Suitable for operating temperatures from -55°C up to 105°C.
  • The compact dimensions ensure space-efficient PCB integration.
  • Beryllium copper alloy contacts offer excellent electrical conductivity.
  • Vertical orientation supports standard ladder style DIP socket applications.

Product Description

TE Connectivity 2-1571586-2 is a high-quality DIPLOMATE 800 series open frame DIL socket designed for vertical mounting on PCBs. It features 8 contacts arranged with a 2.54 mm pitch and a row width of 7.62 mm, optimized for through hole soldering processes in electronic assembly.

This socket supports currents up to 3A with turned pin contacts made from beryllium copper alloy, ensuring reliable electrical connectivity. The contacts are plated with tin and gold to enhance corrosion resistance and longevity of the connection.

The housing is constructed from Polycyclohexylenedimethylene Terephthalate, which is rated UL 94V-0 for flame retardancy, providing safety and durability even under elevated temperatures up to 105°C. Its minimum operating temperature rating of -55°C makes it suitable for a variety of industrial and commercial electronic applications.

With a compact size of 10.16 mm in length and depth and 4.57 mm width, this open frame socket allows for efficient use of PCB area. The vertical orientation and standard ladder-style design are ideal for mounting integrated circuits and adapters in computing, communications, and control equipment.

The DIPLOMATE 800 series ensures high performance for IC socket needs. Contact plating of tin and gold maintains electrical integrity and prevents oxidation. Through hole mounting improves mechanical stability on printed circuit boards.

Open frame construction reduces material usage while preserving strength. Robust operating temperature range suits diverse environmental conditions. Beryllium copper alloy contacts offer excellent conductivity and spring properties.

Standard 2.54 mm pitch matches common IC package sizes. Compatible with solder termination for secure PCB integration.

This product is ideal for industrial electronics manufacturing, repair, prototyping, and laboratory use where reliable and standard-compliant socketing solutions are required. Its open frame design caters to high-density applications requiring dependable IC connections.

Explore EnvMart's extensive range of DIL Sockets and TE Connectivity products for trusted industrial electronic components suitable for a broad spectrum of professional applications.

TE Connectivity DIPLOMATE 800 Vertical 8 Way Through Hole Turned Pin Open Frame DIL Socket 2.54 mm Pitch 3A 2-1571586-2
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