Wurth Elektronik WE-TGF Series Thermal Gap Pad 0.5 mm Thickness 2 W/mK Thermal Conductivity 100 mm x 100 mm Ceramic 40112005

Wurth Elektronik 40112005 WE-TGF Series Thermal Gap Pad is a high-performance ceramic filled silicone rubber pad designed for optimal thermal interface between heatsinks and electronic components. With a precise thickness of 0.5 mm and thermal conductivity of 2 W/mK, it effectively bridges air gaps and uneven surface textures to improve heat dissipation and device reliability.

The pad measures 100 mm in length and width, offering a square form factor suitable for various industrial thermal management needs. Its hardness of 45 Shore C provides the right balance of compressibility and mechanical stability, ensuring intimate contact without damage.

The light blue color identifies the pad and facilitates easy installation inspection. This thermal gap pad is compliant with international environmental and safety standards, including RoHS and REACH, and is halogen-free according to JEDEC JS709B and IEC 61249-2-21, making it suitable for environmentally conscious industrial applications.

Operational temperature range from -50°C up to +180°C ensures consistent performance under demanding thermal cycling and harsh environmental conditions. The material’s ceramic filler enhances thermal conductivity while maintaining electrical insulation, essential for safe electronic device operation.

Its primary applications include use in HVAC systems, electronics heating and cooling components, thermal interface materials for PCB assemblies, and industrial thermal management modules. It is specifically engineered for industries like electronics manufacturing, HVAC, laboratory instruments, and commercial thermal management solutions.

This pad offers a reliable, durable, and efficient thermal interface solution, extending device lifespan and improving thermal performance. Its adhesive-free form factor simplifies maintenance and replacement during service intervals.

This thermal pad is made from ceramic filled silicone rubber providing efficient thermal interface material. It features a hardness of 45 Shore C, balancing flexibility and durability. The light blue pad operates reliably within -50°C to 180°C temperature range.

Compliant with RoHS and REACH regulations and halogen free per JEDEC JS709B and IEC 61249-2-21 standards. Designed to fill air gaps and accommodate uneven surfaces between heatsinks and electronic devices. Ideal for use in electronics heating and cooling components and thermal management applications.

Its dimensions ensure compatibility with common heatsink sizes and thermal module assemblies. Explore more high-quality thermal interface materials and components in the Electronics Components category at EnvMart to optimize your thermal design projects.

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