Wurth Elektronik WE-TGF Series Thermal Gap Pad 0.5 mm Thickness 2 W/mK Thermal Conductivity Silicone with Ceramic 40102005

Wurth Elektronik 40102005 Thermal Gap Pad is a high-quality thermal interface material designed to bridge gaps between heatsinks and electronic devices, especially where air gaps or surface irregularities prevent effective heat transfer through grease or paste.

With a thickness of 0.5 mm and thermal conductivity of 2 W/mK, this gap pad facilitates efficient thermal conduction to maintain optimal operating temperatures. The silicone base infused with ceramic particles enhances thermal transfer while maintaining flexibility and durability, rated at 45 Shore C hardness.

Measuring 400 mm in length and 200 mm in width, the pad fits a variety of electronic component configurations. The light blue coloration aids visual confirmation during assembly processes.

This thermal pad is engineered to operate reliably across extreme temperature ranges, from -50°C up to 180°C, making it suitable for demanding industrial, electronics manufacturing, automotive, HVAC, and electrical applications.

It is certified to meet RoHS compliance, REACh regulations, and halogen-free standards such as IEC 61249-2-21 and JEDEC JS709B ensuring environmental safety and regulatory adherence.

The thermal pad has a thickness of 0.5 mm providing effective gap filling between surfaces. Thermal conductivity of 2 W/mK ensures efficient heat dissipation. Constructed with silicone filled with ceramic particles for improved thermal performance.

Dimensions measure 400 mm in length and 200 mm in width, suitable for various electronics applications. Light blue color facilitates easy identification during installation. Operates reliably within a temperature range from -50°C to 180°C.

Has a hardness rating of 45 Shore C balancing flexibility and durability. Complies with multiple standards including RoHS, REACh, and halogen-free approvals ensuring environmental safety.

Wurth Elektronik thermal gap pads are widely used in electronics manufacturing to optimize heat dissipation between components and heatsinks, ensuring product longevity and efficiency in industrial, laboratory, HVAC, and electronic device assembly contexts.

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