Wurth Elektronik WE-TGF Series Thermal Gap Pad, 5 mm Thick, 2 W/mK Thermal Conductivity, 400 mm x 200 mm Ceramic 40002050

Wurth Elektronik 40002050 Thermal Gap Pad is a premium thermal interface material designed to efficiently manage heat transfer between heatsinks and electronic devices.

The pad measures 400 mm by 200 mm, providing ample coverage for a range of industrial applications in electronics, HVAC, and thermal management systems. It features a hardness of 20 Shore C, balancing compressibility with mechanical stability, ensuring consistent performance across its operating temperature range from -50°C to 180°C.

Its light blue color facilitates easy inspection during assembly and maintenance. The material complies with REACH and RoHS directives (2011/65/EU & 2015/863), aligning with environmental and safety regulations. The WE-TGF series is trusted for durability and reliable thermal performance in laboratory, manufacturing, and commercial electronic components.

This thermal pad is ideal for industrial environments requiring robust thermal management solutions, including automation, power electronics, and HVAC devices. It enhances the lifespan and efficiency of electronic assemblies by minimizing thermal resistance.

Thickness of 5 mm ensures proper interface filling and gap management. Ceramic filled silicone rubber provides electrical insulation and heat conductivity. Wide operating temperature range from -50°C to 180°C for versatile use.

Compliant with REACH and RoHS environmental standards. Suitable for industrial, laboratory, and commercial electronics thermal management. Explore Wurth Elektronik’s complete range of thermal interface materials on EnvMart for optimized electronic cooling solutions.

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