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Samtec ERF8 Series 20-Contact 2 Row 0.8 mm Pitch Vertical Surface PCB Socket ERF8

Category PCB Sockets Brand Samtec Condition New

Specifications

Country of Origin India
Voltage 318V
Brand Samtec
Orientation Vertical
Current 2.2A
Model ERF8
Mount Type Surface
Housing Material Liquid Crystal Polymer
Contact Material Beryllium Copper Alloy
Series ERF8
Termination Type Solder
Maximum Operating Temperature 125°C
Sub Type Board-to-Board
Minimum Operating Temperature -55°C
Number of Rows 2
Pitch 0.8mm
Contact Plating Gold
Number of Contacts 20
Connector System Board-to-Board
Stacking Height 18mm
Row Pitch 4.5mm

Key Features

  • Offers a maximum current rating of 2.2A for reliable electrical performance.
  • Constructed with liquid crystal polymer housing material for enhanced durability.
  • Features beryllium copper alloy contacts plated with gold for superior conductivity.
  • Supports operating temperatures from -55°C to 125°C for varied environments.
  • Vertical orientation with 18 mm stacking height allows compact PCB mounting.
  • Designed with rugged edge rate contacts suitable for high-speed data transmission up to 56Gbps PAM4.
  • Operating voltage rated at 318V ensuring safe electrical operation.
  • Pitch of 0.8 mm and row pitch of 4.5 mm provides precise connectivity spacing.

Product Description

Samtec ERF8 Series vertical surface PCB socket ERF8 is engineered for high-speed board-to-board connections with 20 contacts arranged in 2 rows and a pitch of 0.8 mm. This socket supports reliable electrical performance with a current rating of 2.2A and a voltage rating of 318V, suitable for advanced electronic applications.

The socket housing is made from liquid crystal polymer, offering excellent mechanical strength and chemical resistance. Contacts are crafted from beryllium copper alloy and plated with gold to ensure optimal electrical conductivity and corrosion resistance. Its vertical orientation and 18 mm stacking height enable compact integration on printed circuit boards while maintaining performance.

Operating temperature range spans from -55°C to 125°C, allowing use in harsh industrial and commercial environments. The ERF8 socket series supports rugged edge rate contacts designed to handle data transmission speeds up to 56Gbps PAM4, making it ideal for high-speed data and telecommunications systems.

Other key design parameters include a row pitch of 4.5 mm which maintains adequate spacing for signal integrity. The connector system is board-to-board, optimized for solder termination for durability in assembly processes. Despite advanced features, the unit complies with no specific standards or approvals and is provided as a new product.

Typical applications include industrial electronics, telecommunications, data communications, and high-performance computing where precise, reliable PCB connections are essential. This product suits engineers and manufacturers requiring robust sockets for compact, high-speed electronic devices.

Offers a maximum current rating of 2.2A for reliable electrical performance. Constructed with liquid crystal polymer housing material for enhanced durability. Features beryllium copper alloy contacts plated with gold for superior conductivity.

Supports operating temperatures from -55°C to 125°C for varied environments. Vertical orientation with 18 mm stacking height allows compact PCB mounting. Designed with rugged edge rate contacts suitable for high-speed data transmission up to 56Gbps PAM4.

Operating voltage rated at 318V ensuring safe electrical operation. Pitch of 0.8 mm and row pitch of 4.5 mm provides precise connectivity spacing. Explore the extensive range of PCB Sockets at EnvMart to find compatible components for your electronic design and manufacturing needs.

Samtec ERF8 Series 20-Contact 2 Row 0.8 mm Pitch Vertical Surface PCB Socket ERF8
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Frequently Asked Questions

The maximum current rating for this model is 2.2A, ensuring reliable electrical performance.

The operating voltage is rated at 318V, allowing for safe electrical operation.

It is constructed with a liquid crystal polymer housing and features beryllium copper alloy contacts plated with gold for superior conductivity.

The socket supports operating temperatures from -55°C to 125°C, making it suitable for varied environments.

The pitch of this socket is 0.8 mm, with a row pitch of 4.5 mm, providing precise connectivity spacing.

This model features 20 contacts arranged in 2 rows, designed for board-to-board connections.

The stacking height of this socket is 18 mm, allowing for compact PCB mounting.

It uses solder termination, which is optimized for durability in assembly processes.

The connector system is designed for board-to-board connections, suitable for high-speed applications.

Typical applications include industrial electronics, telecommunications, data communications, and high-performance computing.

The contacts are designed with rugged edge rate features, suitable for high-speed data transmission up to 56Gbps PAM4.

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