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| Country of Origin | India |
|---|---|
| Voltage | 318V |
| Brand | Samtec |
| Orientation | Vertical |
| Current | 2.2A |
| Model | ERF8 |
| Mount Type | Surface |
| Housing Material | Liquid Crystal Polymer |
| Contact Material | Beryllium Copper Alloy |
| Series | ERF8 |
| Termination Type | Solder |
| Maximum Operating Temperature | 125°C |
| Sub Type | Board-to-Board |
| Minimum Operating Temperature | -55°C |
| Number of Rows | 2 |
| Pitch | 0.8mm |
| Contact Plating | Gold |
| Number of Contacts | 20 |
| Connector System | Board-to-Board |
| Stacking Height | 18mm |
| Row Pitch | 4.5mm |
Samtec ERF8 Series vertical surface PCB socket ERF8 is engineered for high-speed board-to-board connections with 20 contacts arranged in 2 rows and a pitch of 0.8 mm. This socket supports reliable electrical performance with a current rating of 2.2A and a voltage rating of 318V, suitable for advanced electronic applications.
The socket housing is made from liquid crystal polymer, offering excellent mechanical strength and chemical resistance. Contacts are crafted from beryllium copper alloy and plated with gold to ensure optimal electrical conductivity and corrosion resistance. Its vertical orientation and 18 mm stacking height enable compact integration on printed circuit boards while maintaining performance.
Operating temperature range spans from -55°C to 125°C, allowing use in harsh industrial and commercial environments. The ERF8 socket series supports rugged edge rate contacts designed to handle data transmission speeds up to 56Gbps PAM4, making it ideal for high-speed data and telecommunications systems.
Other key design parameters include a row pitch of 4.5 mm which maintains adequate spacing for signal integrity. The connector system is board-to-board, optimized for solder termination for durability in assembly processes. Despite advanced features, the unit complies with no specific standards or approvals and is provided as a new product.
Typical applications include industrial electronics, telecommunications, data communications, and high-performance computing where precise, reliable PCB connections are essential. This product suits engineers and manufacturers requiring robust sockets for compact, high-speed electronic devices.
Offers a maximum current rating of 2.2A for reliable electrical performance. Constructed with liquid crystal polymer housing material for enhanced durability. Features beryllium copper alloy contacts plated with gold for superior conductivity.
Supports operating temperatures from -55°C to 125°C for varied environments. Vertical orientation with 18 mm stacking height allows compact PCB mounting. Designed with rugged edge rate contacts suitable for high-speed data transmission up to 56Gbps PAM4.
Operating voltage rated at 318V ensuring safe electrical operation. Pitch of 0.8 mm and row pitch of 4.5 mm provides precise connectivity spacing. Explore the extensive range of PCB Sockets at EnvMart to find compatible components for your electronic design and manufacturing needs.
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