Molex Pico-Clasp Series Right Angle Surface PCB Header 4 Contact 1 mm Pitch 1 Row Shrouded 501568-0407

Molex 501568-0407 Pico-Clasp Series Right Angle Surface PCB Header is a high-density, reliable wire-to-board connector system designed for compact and space-sensitive electronic applications. It features a 1.00 mm pitch in a single-row, 4-contact configuration with shrouded housing that secures connections and enhances mechanical stability.

The housing material is made of durable nylon, providing excellent insulation and resistance to environmental factors. The contacts are constructed from brass with tin plating, ensuring high conductivity and corrosion resistance over extended use.

This connector system supports a current rating of 1 amp and is rated for voltages up to 50 volts, making it ideal for low power PCB interconnections. Its termination type is designed for surface mount soldering, simplifying assembly processes for modern electronic manufacturing.

With a right angle orientation, the connector is suitable for applications with limited vertical space on PCBs. The operating temperature range from -40°C to 105°C ensures reliability across a variety of industrial and commercial environments.

The male contacts feature a 1 mm mating pin length to ensure precise mating with corresponding headers. The positive lock design inside the header guarantees a secure connection even under vibration or mechanical stress.

Compact 1.00 mm pitch wire-to-board connector system with positive lock. Right angle orientation suitable for space-constrained PCB layouts. Nylon housing provides strong insulation and durability. Brass contacts with tin plating enhance conductivity and corrosion resistance.

Rated for 1 amp current and 50 volts operating voltage. Surface mount solder termination for efficient PCB assembly. Wide operating temperature range from -40°C to 105°C. Single row, shrouded connector ensures secure, reliable connections.

Manufactured in Japan with high quality standards.

This connector is widely used in electronics manufacturing for applications in industrial automation, telecommunications, consumer electronics, and automotive electronics. Its small form factor and secure locking mechanism make it ideal for high-density PCB designs requiring compact, reliable interconnect solutions.

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