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| Country of Origin | India |
|---|---|
| Size | 3.2mm x 1.6mm x 1.2mm |
| Brand | EPIGAP OSA Photonics |
| Model | OIS-150-1550p-X-T |
| Technology | GaP, AlInGaP, GaAlAs and InGaN |
| Packaging | Taped in 8 mm Blister Tape |
| Mount Type | Surface |
| Series | OIS-150 |
| Number Of Leds | 1 |
| Package Type | 1206 |
| Standards/Approvals | RoHs and Reach |
| Number of Pins | 2 |
| Lens Shape | Square |
| Peak Wavelength | 1550nm |
| LED Material | InGaN, GaAlAs, GaP, AlInGaP |
| Radiant Intensity | 0.27mW/sr |
| view angle | 140° |
| soldering pads | gold plated |
| circuit substrate | glass laminated epoxy |
| Lead free solderable, soldering pads | gold plated |
| taping | face-up(TU) or face-down(TD) possible |
EPIGAP OSA Photonics OIS-150-1550p-X-T is a high-performance Infrared LED designed for precision optical applications. It operates at a peak wavelength of 1550 nm, making it suitable for infrared sensing, communication, and industrial uses such as water treatment monitoring and security systems.
The device is housed in a compact 1206 surface mount package measuring 3.2 mm x 1.6 mm x 1.2 mm, featuring a square lens shape. This IR LED utilizes InGaN, GaAlAs, GaP, and AlInGaP semiconductor materials, ensuring enhanced brightness and efficiency.
The LED provides a radiant intensity of 0.27 mW/sr and a wide viewing angle of 140°, allowing for effective optical coverage. Its soldering pads are gold plated and lead-free solderable, mounted on a glass laminated epoxy substrate for robust mechanical and electrical performance.
Packaged in an 8 mm blister tape with face-up or face-down taping options, the product supports all surface-mount technology (SMT) assembly methods. It meets RoHS and REACH standards, ensuring environmental compliance.
Typical industry sectors include electronic component manufacturing, automated systems, and specialized lighting solutions. This IR LED operates at a peak wavelength of 1550 nm. It has a radiant intensity of 0.27 mW/sr for reliable optical output.
The compact 1206 package size measures 3.2 mm x 1.6 mm x 1.2 mm. Features a square lens shape and surface mount technology suitable for SMT assembly. The device includes gold-plated soldering pads and a glass laminated epoxy circuit substrate.
Offers a 140° viewing angle with options for colored or diffused encapsulation. Complies with RoHS and REACH environmental standards. Packaged in taped 8 mm blister tape for automated assembly processes.
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