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| Country of Origin | India |
|---|---|
| Size | 3.2mm x 1.6mm x 1.9mm |
| Brand | EPIGAP OSA Photonics |
| Model | OIS-330-770-X-TU |
| Technology | GaP, AlInGaP, GaAlAs and InGaN |
| Packaging | Tape |
| Mount Type | Surface |
| Series | OIS-330 |
| Number Of Leds | 1 |
| Package Type | 1206 |
| Number of Pins | 2 |
| Lens Shape | Dome |
| Maximum Supply Voltage | 2V |
| Peak Wavelength | 770nm |
| LED Material | GaP, InGaN, GaAlAs, AlInGaP |
| Radiant Intensity | 7.1mW/sr |
| view angle | 40° |
| soldering pads | gold plated |
| circuit substrate | glass laminated epoxy |
| Lead free solderable, soldering pads | gold plated |
| taping | face-up(TU) or face-down(TD) possible |
EPIGAP OSA Photonics OIS-330-770-X-TU is a high brightness infrared light-emitting diode (IR LED) designed for industrial, scientific, and electronic applications. Featuring a precise peak wavelength of 770 nm, this IR LED offers reliable performance in sensing, detection, and illumination.
Housed in a compact 1206 surface mount package measuring 3.2 mm x 1.6 mm x 1.9 mm, the device integrates easily into printed circuit boards, supporting modern SMT manufacturing processes. The dome-shaped lens produces a focused 40° viewing angle, facilitating directed IR emission essential in optical systems and communication devices.
The LED is constructed using advanced semiconductor materials including GaP, AlInGaP, GaAlAs, and InGaN, ensuring superior luminous efficiency and longevity. It features gold-plated soldering pads that are lead-free solderable, providing excellent electrical connectivity and compliance with modern environmental standards.
The circuit substrate uses glass laminated epoxy, contributing to device robustness and mechanical stability. With a maximum supply voltage of 2 V, the LED operates efficiently under controlled electrical conditions. Supplied on tape packaging, face-up (TU) or face-down (TD) configurations allow flexible integration into automated assembly lines.
Peak wavelength: 770 nm for precise IR emission. Radiant intensity: 7.1 mW/sr ensuring bright output. Package: 1206 surface mount for compact footprint. Lens shape: Dome lens with 40° viewing angle. Gold plated soldering pads enable reliable connections and lead-free soldering.
Glass laminated epoxy substrate enhances durability. Single LED with 2 pins optimized for SMT assembly. Tape packaging with face-up or face-down options supports manufacturing efficiency.
This IR LED is suitable for applications in electronics manufacturing, industrial sensing, automated equipment, and optical instrumentation. Its compact size and robust design make it an ideal component for high precision and high reliability IR illumination and detection tasks.
Explore our full range of photonics and LED components to find the right solution for your industrial and technological needs.
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