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| Country of Origin | India |
|---|---|
| Size | 3.2mm x 1.6mm x 1.2mm |
| Brand | EPIGAP OSA Photonics |
| Model | OIS-150-1550p-X-T |
| Technology | GaP, AlInGaP, GaAlAs and InGaN |
| Packaging | Taped in 8 mm Blister Tape |
| Mount Type | Surface |
| Series | OIS-150 |
| Number Of Leds | 1 |
| Package Type | 1206 |
| Standards/Approvals | RoHs and Reach |
| Number of Pins | 2 |
| Lens Shape | Square |
| Peak Wavelength | 1550nm |
| LED Material | InGaN, GaAlAs, GaP, AlInGaP |
| Radiant Intensity | 0.27mW/sr |
| view angle | 140° |
| soldering pads | gold plated |
| circuit substrate | glass laminated epoxy |
| Lead free solderable, soldering pads | gold plated |
| taping | face-up(TU) or face-down(TD) possible |
EPIGAP OSA Photonics OIS-150-1550p-X-T is a specialized infrared LED operating at a peak wavelength of 1550 nm. Packaged in the standard 1206 surface mount design measuring 3.2 mm length, 1.6 mm width, and 1.2 mm height, it is optimized for various electronic and photonics applications requiring near-infrared light emission.
This IR LED delivers a radiant intensity of 0.27 mW/sr and features a square lens shape with a wide 140° viewing angle, enabling efficient light dispersion and stable output performance. The device incorporates a combination of advanced LED materials such as InGaN, GaAlAs, GaP, and AlInGaP, providing high brightness and spectral accuracy for precision sensing and illumination.
The robust design includes gold-plated soldering pads that facilitate lead-free soldering and ensure strong mechanical and electrical connections on glass laminated epoxy circuit substrates. Its packaging on 8 mm blister tapes supports compatibility with automated SMT assembly lines, enhancing production efficiency and reducing handling risks.
It is not certified for automotive standards but is suitable for a wide range of commercial and manufacturing uses. High brightness infrared LED emitting at 1550 nm wavelength. Standard 1206 surface mount package suitable for SMT production.
Wide 140° viewing angle for broad light dispersion. Gold-plated, lead-free soldering pads for reliable mounting. Glass laminated epoxy substrate enhances durability and performance. Taped packaging compatible with automated assembly lines.
Multi-material LED composition for enhanced light output. Complies with environmental safety standards RoHS and REACH.
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