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EPIGAP OSA Photonics 770 nm IR LED 1206 Surface Package OIS-330-770-X-TU
Specifications
| Country of Origin | India |
|---|---|
| Size | 3.2mm x 1.6mm x 1.9mm |
| Brand | EPIGAP OSA Photonics |
| Model | OIS-330-770-X-TU |
| Technology | GaP, AlInGaP, GaAlAs and InGaN |
| Packaging | Tape |
| Mount Type | Surface |
| Series | OIS-330 |
| Number Of Leds | 1 |
| Package Type | 1206 |
| Number of Pins | 2 |
| Lens Shape | Dome |
| Maximum Supply Voltage | 2V |
| Peak Wavelength | 770nm |
| LED Material | GaP, InGaN, GaAlAs, AlInGaP |
| Radiant Intensity | 7.1mW/sr |
| view angle | 40° |
| soldering pads | gold plated |
| circuit substrate | glass laminated epoxy |
| Lead free solderable, soldering pads | gold plated |
| taping | face-up(TU) or face-down(TD) possible |
Key Features
- Peak wavelength of 770 nm for infrared emission.
- Radiant intensity rated at 7.1 mW/sr for efficient output.
- Compact 1206 surface mount package measuring 3.2 mm x 1.6 mm x 1.9 mm.
- Gold plated soldering pads ensure reliable solder connections.
- Suitable for all SMT assembly methods with tape packaging.
- Single LED with dome lens shape offering a 40° viewing angle.
- Circuit substrate made from glass laminated epoxy optimized for durability.
- Compatible with supply voltage up to 2 V maximum.
Product Description
EPIGAP OSA Photonics OIS-330-770-X-TU 770 nm Infrared LED in a 1206 surface mount package is engineered for high brightness and reliable infrared light emission suitable for electronics, industrial, and communication applications.
This LED features a peak wavelength of 770 nm and a radiant intensity of 7.1 mW/sr, providing consistent infrared output. It is housed in a compact 1206 size package measuring 3.2 mm in length, 1.6 mm in width, and 1.9 mm in height, with a dome-shaped lens delivering a 40° viewing angle for focused light emission.
The component utilizes GaP, AlInGaP, GaAlAs, and InGaN LED materials for optimized performance. Its circuit substrate is constructed from glass laminated epoxy, enhancing mechanical strength and thermal management. Gold plated soldering pads support lead-free soldering processes, ensuring durability and ease of manufacturing in SMT assembly lines. Packaging is done on tape, configurable as face-up (TU) or face-down (TD), compliant with industry tape and reel standards.
This IR LED operates reliably at a maximum supply voltage of 2 V and is not designed for automotive standards or any special approvals. Its small footprint makes it ideal for portable devices, sensors, industrial instrumentation, and other electronics requiring infrared illumination or indication.
Peak wavelength of 770 nm for infrared emission. Radiant intensity rated at 7.1 mW/sr for efficient output. Compact 1206 surface mount package measuring 3.2 mm x 1.6 mm x 1.9 mm. Gold plated soldering pads ensure reliable solder connections.
Suitable for all SMT assembly methods with tape packaging. Single LED with dome lens shape offering a 40° viewing angle. Circuit substrate made from glass laminated epoxy optimized for durability. Compatible with supply voltage up to 2 V maximum.
Lead-free and RoHS compliant for environmentally friendly use.
This product is ideal for use in industrial, communications, sensor, and electronic equipment manufacturing sectors. Explore more IR LEDs and related components in our Electronics Components category at EnvMart.
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Frequently Asked Questions
The peak wavelength of this infrared LED is 770 nm, which is suitable for infrared emission applications.
The radiant intensity of this model is rated at 7.1 mW/sr, providing efficient infrared output.
This model comes in a compact 1206 surface mount package measuring 3.2 mm in length, 1.6 mm in width, and 1.9 mm in height.
The maximum supply voltage for this infrared LED is 2 V.
It features gold plated soldering pads that support lead-free soldering processes for reliable connections.
The dome lens shape of this LED offers a viewing angle of 40° for focused light emission.
The LED materials include GaP, AlInGaP, GaAlAs, and InGaN, which are optimized for performance.
This model is packaged on tape, which can be configured as face-up (TU) or face-down (TD), compliant with industry standards.
The circuit substrate is made from glass laminated epoxy, enhancing mechanical strength and thermal management.
This infrared LED is suitable for use in industrial, communications, sensor, and electronic equipment manufacturing sectors.
This model contains a single LED in its 1206 surface mount package.
The mount type for this infrared LED is surface mount, designed for SMT assembly methods.
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