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| Country of Origin | India |
|---|---|
| Brand | EPIGAP OSA Photonics |
| Height | 1mm |
| Length | 3mm |
| Model | OCU-400-UE390-X-T |
| Packaging | Taped in 8 mm Blister Tape |
| Width | 2mm |
| Mount Type | Surface |
| Encapsulation | silicone |
| Series | OCU-400 |
| Number Of Leds | 1 |
| Package Type | Surface Mount |
| Standards/Approvals | RoHS, REACH |
| Number of Pins | 2 |
| Lens Shape | Square |
| Peak Wavelength | 395nm |
| LED Material | Aluminium Oxide (Ceramic) |
| Siemens Siemens 3SB3 Series Contact Block, 1NCBrand | Siemens |
| UV Type | Ultraviolet |
| circuit substrate | AI2O3 ceramics |
| Lead free solderable, soldering pads | gold plated |
| taping | face-up(T) |
EPIGAP OSA Photonics OCU-400-UE390-X-T is an ultraviolet (UV) LED designed for precise UV illumination applications requiring a peak wavelength of 395 nm. This UV LED features a single LED die housed in a compact 3 mm length, 2 mm width, and 1 mm height surface mount package with a 2-pin configuration, enabling easy integration on printed circuit boards.
The LED material is aluminium oxide ceramic, offering excellent thermal stability and durability, while its silicone encapsulation ensures optimal light transmission and environmental protection. Gold plated soldering pads facilitate reliable, lead-free soldering compliant with modern environmental standards including RoHS and REACH.
Supplied taped in 8 mm blister tape with a face-up (T) orientation, this LED supports automated assembly manufacturing processes. Its square lens shape is engineered to provide uniform, efficient light emission for diverse industrial and laboratory uses.
The OCU-400 family meets the requirements for low to medium power UV LED applications, offering a versatile solution for manufacturing, electronics testing, water treatment, curing, and other photonics uses. The OCU-440 series extends this family for higher power requirements.
Operates at a peak wavelength of 395 nm delivering UV light. Compact surface mount design sized 3.0 x 2.0 x 1.0 mm. Ceramic aluminium oxide substrate and silicone encapsulation. Gold plated, lead-free solder pads for robust mounting.
RoHS and REACH compliant manufacturing standards. Packaged in taped 8 mm blister tape for manufacturing efficiency. Square lens shape for consistent UV emission. Designed for low to medium power UV LED applications. Applicable to industrial, laboratory, electronic, and water treatment uses.
Supports modern automated PCB assembly processes. Explore more from the EPIGAP OSA Photonics range and related UV LED solutions at EnvMart to meet your industrial and scientific application needs.
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