EPIGAP OSA Photonics 740 nm IR LED 8mW/sr 1206 Surface Package OIS-330-740-X-TU

EPIGAP OSA Photonics OIS-330-740-X-TU is a specialized infrared (IR) LED emitting at a peak wavelength of 740 nm, housed in a compact 1206 surface mount package. This LED is engineered for high brightness and precision in electronic components requiring reliable IR light sources.

The LED irradiance of 8 mW/sr coupled with a 40° viewing angle allows focused illumination appropriate for sensing, communication, and display applications across industrial, electronic, and laboratory settings.

Constructed from advanced semiconductor materials including AlInGaP, GaP, InGaN, and GaAlAs, this component assures stable and efficient IR emission. The gold-plated soldering pads facilitate robust surface mounting and maintain solderability standards with lead-free processes.

Compact physical dimensions of 3.2 mm by 1.6 mm by 1.9 mm enable integration in densely packed PCB designs. The circuit substrate is fabricated using glass laminated epoxy, promoting enhanced mechanical strength and thermal performance.

Supplied on tape packaging, the LED is optimized for automated placement on SMT assembly lines, available in both face-up and face-down tape options to meet production versatility. This device stands compliant with no specific automotive or other standards but meets industry quality expectations for general IR LED applications.

Ideal for use in electronic sensing, remote control, data communication, and other IR illumination solutions, the OIS-330-740-X-TU serves OEMs and engineers developing efficient lighting modules with exact wavelength requirements.

The LED uses AlInGaP, GaP, InGaN, and GaAlAs materials for optimal infrared performance. It features a dome lens shape enhancing light emission quality. Gold-plated soldering pads ensure reliable surface mount technology assembly.

The device operates with a maximum supply voltage of 2 V and is lead-free solderable. The compact package size measures 3.2 mm x 1.6 mm x 1.9 mm for space-constrained applications. The circuit substrate is made of glass laminated epoxy for durability and reliability.

Devices are supplied in tape packaging compatible with automated SMT assembly lines. Taping options include face-up (TU) or face-down (TD) orientations to suit manufacturing needs. Suitable for diverse electronics applications requiring infrared illumination or sensing.

Browse the Electronics Components under IR LED category at EnvMart for a wide range of advanced optoelectronics solutions tailored for industrial and commercial electronics innovations.