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EPIGAP OSA Photonics IR LED 740 nm 1206 Surface Package OIS-330-740-X-TU

Category LED Brand EPIGAP OSA Photonics Condition New

Specifications

Country of Origin India
Size 3.2mm x 1.6mm x 1.9mm
Brand EPIGAP OSA Photonics
Model OIS-330-740-X-TU
Technology GaP, AlInGaP, GaAlAs and InGaN
Packaging Tape
Mount Type Surface
Series OIS-330
Number Of Leds 1
Package Type 1206
Number of Pins 2
Lens Shape Dome
Maximum Supply Voltage 2V
Peak Wavelength 740nm
LED Material AlInGaP, GaP, InGaN, GaAlAs
Radiant Intensity 8mW/sr
view angle 40°
soldering pads gold plated
circuit substrate glass laminated epoxy
Lead free solderable, soldering pads gold plated
taping face-up(TU) or face-down(TD) possible

Key Features

  • This IR LED has a radiant intensity of 8mW/sr providing strong infrared illumination.
  • It uses a dome-shaped lens with a 40° viewing angle for focused light output.
  • Operates at a maximum supply voltage of 2V ensuring low power consumption.
  • Constructed with gold plated soldering pads for reliable surface mounting.
  • The compact 1206 package measures 3.2 mm x 1.6 mm x 1.9 mm, suitable for various SMT assemblies.
  • Contains one LED per device with two electrical pins for connectivity.
  • Uses a glass laminated epoxy circuit substrate enhancing durability.
  • Packaging includes tape with cathode orientation to transporting perforation optimized for automated assembly.

Product Description

EPIGAP OSA Photonics OIS-330-740-X-TU is a high performance infrared (IR) LED with a peak wavelength of 740 nm designed for precision applications requiring reliable infrared illumination. Housed in a standard 1206 surface mount package, this LED is engineered using advanced semiconductor materials including AlInGaP, GaP, GaAlAs, and InGaN, delivering high radiant intensity of 8 mW/sr with stable output.

The device features a dome-shaped lens which provides a 40° viewing angle, allowing effective directional infrared light suitable for sensing, communication, and detection systems in electronics and optoelectronics industries. Operating at a maximum supply voltage of 2 volts, it maintains low power consumption, ideal for battery-powered and energy-conscious designs.

The LED is equipped with gold plated solder pads and a glass laminated epoxy circuit substrate to ensure excellent solderability and mechanical robustness for sophisticated surface mount technology (SMT) assembly methods. This product includes one LED, two pins, and is tape-packaged for efficient automated manufacturing workflows.

This IR LED is widely applicable in electronic components, power and connectors, displays, and optoelectronics sectors, serving industrial, laboratory, and communication applications requiring precise infrared light emission with compact form factor.

This IR LED has a radiant intensity of 8mW/sr providing strong infrared illumination. It uses a dome-shaped lens with a 40° viewing angle for focused light output. Operates at a maximum supply voltage of 2V ensuring low power consumption.

Constructed with gold plated soldering pads for reliable surface mounting. The compact 1206 package measures 3.2 mm x 1.6 mm x 1.9 mm, suitable for various SMT assemblies. Contains one LED per device with two electrical pins for connectivity.

Uses a glass laminated epoxy circuit substrate enhancing durability. Packaging includes tape with cathode orientation to transporting perforation optimized for automated assembly.

Choose EPIGAP OSA Photonics IR LEDs for dependable, high-quality infrared lighting components. Explore our catalog for a complete range of electronic LEDs and optoelectronic components.

EPIGAP OSA Photonics IR LED 740 nm 1206 Surface Package OIS-330-740-X-TU
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Frequently Asked Questions

The peak wavelength of this IR LED is 740 nm, making it suitable for precision applications requiring infrared illumination.

This model has a radiant intensity of 8 mW/sr, providing strong infrared illumination for various applications.

The maximum supply voltage for this infrared LED is 2 volts, ensuring low power consumption during operation.

The compact 1206 package measures 3.2 mm x 1.6 mm x 1.9 mm, making it suitable for various surface mount technology (SMT) assemblies.

It features a dome-shaped lens with a 40° viewing angle, allowing for focused infrared light output.

This infrared LED contains two electrical pins for connectivity, facilitating easy integration into circuits.

The LED is constructed using advanced semiconductor materials including AlInGaP, GaP, GaAlAs, and InGaN, enhancing its performance.

This model is designed for surface mounting, which is common in modern electronic assemblies.

The LED is packaged in tape with cathode orientation, optimized for automated assembly processes.

It uses a glass laminated epoxy circuit substrate, which enhances durability and solderability.

The country of origin for this infrared LED is India.

This IR LED is widely applicable in electronic components, power and connectors, displays, and optoelectronics sectors, suitable for industrial and communication applications.

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