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Samtec ERF8 Series Straight Surface PCB Socket, 40-Contact, 2 Row, 0.8 mm Pitch, 2.2A, 318V, Liquid Crystal Polymer Housing

Category PCB Socket Brand Samtec Condition New

Specifications

Country of Origin United States
Voltage 318V
Brand Samtec
Orientation Straight
Current 2.2A
Model ERF8
Mount Type Surface
Housing Material Liquid Crystal Polymer
Contact Material Bronze
Series ERF8
Termination Type Solder
Maximum Operating Temperature 125°C
Sub Type Board-to-Board
Minimum Operating Temperature -55°C
Number of Rows 2
Positions Up to 200
Pitch 0.8mm
Contact Plating Gold
Number of Contacts 40
Connector System Board-to-Board
Stacking Height 18mm
Row Pitch 4.5mm
Stack Height 7.00 mm - 16.00 mm

Key Features

  • Features a straight orientation with surface mount installation.
  • Constructed with liquid crystal polymer housing for durability.
  • Bronze contacts plated with gold for reliable conductivity.
  • Operates within a temperature range from -55°C to 125°C.
  • Stacking height is 18mm suitable for varied board configurations.
  • Supports a row pitch of 4.5mm for compact arrangement.
  • Designed for rugged high-speed signaling up to 28+ Gbps.
  • Positions up to 200 available in the series for scaling applications.

Product Description

Samtec ERF8-020-05.0-S-DV-K-TR is a straight surface PCB socket designed for sophisticated electronic applications demanding reliable board-to-board connections. This 40-contact socket utilizes a 0.8 mm pitch and 2-row configuration, making it suitable for high-density layouts requiring consistent signal integrity.

The housing is engineered from liquid crystal polymer, offering excellent thermal stability and mechanical strength. Contacts are fabricated from bronze and plated with gold, ensuring high durability and low contact resistance for robust electrical performance.

Designed to handle currents up to 2.2A and voltages up to 318V, it operates reliably across a broad temperature range from -55°C to 125°C. The 18 mm stacking height supports versatile stacking needs, and a row pitch of 4.5 mm allows compact placement on printed circuit boards.

This socket supports the rugged Edge Rate® technology facilitating high-speed data transmission over 28 Gbps, ideal for demanding industrial, telecommunications, computing, and aerospace electronic manufacturing environments.

Positions available up to 200 in this series provide flexible design scalability. Manufactured in the United States, it conforms to stringent quality manufacturing practices. Features a straight orientation with surface mount installation.

Constructed with liquid crystal polymer housing for durability. Bronze contacts plated with gold for reliable conductivity. Operates within a temperature range from -55°C to 125°C. Stacking height is 18mm suitable for varied board configurations.

Supports a row pitch of 4.5mm for compact arrangement. Designed for rugged high-speed signaling up to 28+ Gbps. Positions up to 200 available in the series for scaling applications. Dual sourced by Hirose for supply chain reliability.

Manufactured in the United States ensuring quality standards.

This Samtec ERF8 series PCB Socket is ideal for industrial electronics, telecommunications, computing systems, and aerospace applications requiring precise and reliable board-to-board connections. Browse the Electronics Components category on EnvMart for compatible connectors and sockets.

Samtec ERF8 Series Straight Surface PCB Socket, 40-Contact, 2 Row, 0.8 mm Pitch, 2.2A, 318V, Liquid Crystal Polymer Housing
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Frequently Asked Questions

It can handle a maximum current of 2.2A.

The voltage rating for this model is 318V.

It operates reliably within a temperature range from -55°C to 125°C.

This model features 40 contacts.

The contact pitch size is 0.8 mm.

The housing is constructed from liquid crystal polymer, which provides excellent thermal stability.

It utilizes a solder termination type.

The stacking height is 18 mm, suitable for various board configurations.

This series offers up to 200 positions for design scalability.

The socket features a straight orientation for surface mount installation.

The row pitch is 4.5 mm, allowing for compact placement on printed circuit boards.

It is suitable for industrial electronics, telecommunications, computing systems, and aerospace applications.

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