Texas Instruments Operational Amplifier 1 MHz 8-Pin SOIC 18V OPA130UA

Texas Instruments OPA130UA is a high-precision, low-noise operational amplifier featuring a 1 MHz gain bandwidth product housed in an 8-pin SOIC surface-mount package. It operates efficiently within a supply voltage range of -18V to 18V and is designed for applications requiring low input offset voltage and bias current. The device’s JFET input stage allows for exceptionally low input offset voltage of ±1 μV and input bias currents of ±20 pA, making it ideal for precision measurement and instrumentation.

Its compact dimensions of 4.9 mm length, 3.91 mm width, and 1.58 mm height enable integration into dense PCB layouts. The OPA130UA supports a wide ambient temperature range from -40°C to 85°C, ensuring reliability across industrial, laboratory, and commercial environments. With a slew rate of 2 V/μs, it provides responsive signal processing suitable for amplifying low-level signals accurately.

This single-channel operational amplifier is suited for uses in electronic components assemblies, power and connectors circuits, semiconductor amplification stages, and audio equipment requiring stable and precise amplification. The SOIC package type supports surface mounting methods, enhancing production efficiency and mechanical robustness.

The OPA130 series is known for its JFET input op amps optimized for low noise and offset voltage, making the OPA130UA model an excellent choice for applications in instrumentation, sensor interfaces, and control systems.

Features JFET input stage for precision amplification. Wide supply voltage range from -18V to 18V supports varied operating environments. Low input offset voltage enhances measurement accuracy. Surface mount SOIC package facilitates compact and efficient assembly.

Single channel op amp suitable for integration in complex semiconductor circuits. Capable of operating over a wide temperature range from -40°C to 85°C. Slew rate of 2V/μs ensures transient response fidelity. Compact dimensions enable high-density PCB designs.

Designed to improve production efficiency with tube packaging.

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