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| Country of Origin | India |
|---|---|
| Voltage | 250, 250V ac |
| Brand | TE Connectivity |
| Orientation | Vertical |
| Current | 1A |
| Frame Type | Ladder |
| Length | 17.78mm |
| Depth | 5.1mm |
| Width | 10mm |
| Mount Type | Through Hole |
| Housing Material | Polybutylene Terephthalate |
| Contact Material | Phosphor Bronze |
| Termination Type | Solder |
| Maximum Operating Temperature | 105°C |
| Minimum Operating Temperature | -40°C |
| Pitch | 2.54mm |
| Contact Plating | Tin |
| Number of Contacts | 16 |
| Pin Type | Standard |
| Row Width | 7.62mm |
TE Connectivity 1-2199298-4 vertical 16 way through hole standard pin ladder DIL socket with 2.54 mm pitch and 1A current rating is engineered for highly reliable electrical connections on printed circuit boards. This DIL Socket features vertical orientation and through hole mounting to ensure secure mechanical and electrical contacts with integrated circuits (ICs). The socket’s ladder frame design facilitates quick and easy IC mating and unmating, improving production efficiency and maintenance.
The 16-contact socket has a pitch of 2.54 mm and row width of 7.62 mm, providing compatibility with common DIP IC packages. Contacts are made of phosphor bronze for robust conductivity and durability, coated with tin plating for excellent solderability and corrosion resistance. The housing uses polybutylene terephthalate material offering mechanical stability and electrical insulation. Operating temperature ranges from -40°C to 105°C, suitable for varied industrial and electronic environments.
This product supports a maximum voltage of 250 V AC and a current rating of 1 A, appropriate for a wide variety of signal and control applications. The solder termination type allows for secure through-hole PCB installation, ensuring strong mechanical mounting and electrical connection.
Applications include industrial controls, intelligent building systems, medical devices, military electronics, and other embedded electronic systems requiring reliable IC socket interfaces. The open frame ladder type design provides easy accessibility for field IC replacement and reduces the risk of IC overheating during soldering.
16 contacts with 2.54 mm pitch and vertical orientation. Through hole solder termination for durable PCB mounting. Phosphor bronze tin-plated contacts for consistent conductivity. Polybutylene terephthalate housing material for insulation and stability.
Operating temperatures from -40°C to 105°C for harsh environments. Rated 1 A current and 250 V AC voltage for versatile electronic applications. Ladder frame type facilitates IC insertion, removal, and stacking. Compact dimensions of length 17.78 mm, width 10 mm, and depth 5.1 mm.
Ideal for industrial, medical, military, and embedded system electronics. Explore EnvMart’s extensive Electronics Components category for reliable TE Connectivity sockets and connectors that meet your design and manufacturing requirements.
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