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CIF Double-Sided Flexible Copper Clad Board Epoxy Glass Fabric Laminate 35μm Copper Thickness 600mm AN210
Specifications
| Country of Origin | France |
|---|---|
| Brand | CIF |
| Length | 600mm |
| Model | AN210 |
| Board Material | Epoxy Glass Fabric Laminate |
| Standards/Approvals | RoHS |
| Number of Sides | 2 |
| Board Thickness | 0.05mm |
| FR Material Grade | FR4 |
| Copper Thickness | 35μm |
Key Features
- This board provides excellent flexibility suitable for complex circuit designs.
- Constructed with FR4-grade epoxy glass fabric for durability and insulation.
- Features 35μm thick copper layers on both sides for reliable conductivity.
- Board thickness of 0.05mm ensures minimal profile while maintaining strength.
- Compliant with RoHS standards for safety and environmental protection.
- Manufactured in France ensuring consistent quality and performance.
Product Description
The CIF AN210 is a double-sided flexible copper clad board designed with 35μm copper thickness on epoxy glass fabric laminate material. It measures 600mm in length and has a thin profile of 0.05mm thickness. This high-quality board uses FR4 grade material ensuring excellent insulation and mechanical stability, making it suitable for advanced electronic prototyping and manufacturing applications.
Due to its flexible nature, this board is ideal for use in electronic circuits requiring bending or folding without damage. It supports complex circuit assembly, enabling designers to optimize space and electrical layouts effectively.
The product meets RoHS compliance standards, which guarantees it is free from hazardous substances, supporting safe and environmentally responsible manufacturing processes. Made in France, it ensures consistent product quality and reliability for professional users.
Key applications include flexible circuit designs, electronic prototyping boards, and custom electronic fabrication industries. Its thin board thickness combined with robust copper layering allows it to handle moderate electrical loads with excellent performance and durability.
This board provides excellent flexibility suitable for complex circuit designs. Constructed with FR4-grade epoxy glass fabric for durability and insulation. Features 35μm thick copper layers on both sides for reliable conductivity.
Board thickness of 0.05mm ensures minimal profile while maintaining strength. Compliant with RoHS standards for safety and environmental protection. Manufactured in France ensuring consistent quality and performance.
This flexible copper clad board is an essential component in electronics manufacturing, prototyping environments, and research laboratories where high precision and quality flexibility are required. You can explore more products and solutions in the Copper Clad Boards category at EnvMart to support your industrial and electronic fabrication needs.
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Frequently Asked Questions
The board has a thickness of 0.05mm.
This model measures 600mm in length.
It is constructed from epoxy glass fabric laminate, specifically using FR4 grade material.
The copper thickness is 35μm on both sides of the board.
Yes, it is compliant with RoHS standards, ensuring it is free from hazardous substances.
This product is manufactured in France, ensuring consistent quality.
This model features copper cladding on two sides.
It is suitable for flexible circuit designs, electronic prototyping boards, and custom electronic fabrication.
Key features include excellent flexibility, 35μm copper layers, and a thin profile for complex circuit designs.
The flexibility allows for bending or folding without damage, making it ideal for advanced electronic circuit assembly.
It can handle moderate electrical loads effectively due to its robust copper layering.
FR4 grade material provides excellent insulation and mechanical stability, enhancing the board's performance in electronic applications.
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