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CIF Photoresist Board Epoxy Glass Fabric Laminate 300mm Length 0.8mm Width 35μm Copper Thickness FR4 Board AAB20
Specifications
| Country of Origin | France |
|---|---|
| Brand | CIF |
| Length | 300mm |
| Model | AAB20 |
| Width | 0.8mm |
| Fire Resistance | UL 94-V0 |
| Board Material | Epoxy Glass Fabric Laminate |
| Standards/Approvals | UL, CSA |
| Number of Sides | 1 |
| Board Thickness | 200mm |
| FR Material Grade | FR4 |
| Copper Thickness | 35μm |
| Developer concentration | use sachet 160-9490 or 6-10g/l of Sodium or Potassium Hydroxide. Conduct trials if in doubt |
Key Features
- Board is 300 mm in length and 0.8 mm wide for precise electronic component layouts.
- Features a copper thickness of 35 μm ensuring optimal conductivity.
- Constructed with FR4 material grade providing fire resistance rating UL 94-V0.
- Complies with UL and CSA standards for safety and quality assurance.
- Produced in France, providing professional quality blue coloured positive resin surface.
- Developer concentration requires use of sachet 160-9490 or 6-10 g/l Sodium or Potassium Hydroxide.
- Ideal for electronic prototyping, laboratory, and manufacturing applications.
Product Description
CIF AAB20 is a photoresist board constructed using epoxy glass fabric laminate with dimensions 300 mm length and 0.8 mm width. This single-sided copper clad board has a copper thickness of 35 μm and an FR4 board thickness of 200 mm, designed for high precision in electronic component prototyping.
The board is fire resistant with UL 94-V0 rating and complies with international safety standards UL and CSA. It features a blue coloured positive resin surface that is pre-sensitized, ensuring professional quality results suitable for laboratory, manufacturing, and electrical engineering environments.
The board is manufactured in France and adheres to military standard P 13949F M12 13949F. Developer solutions for photoresist processing require the use of sachet 160-9490 or 6-10 g/l of Sodium or Potassium Hydroxide, with trials recommended for optimal chemical concentration.
Board size: 300 mm length, 0.8 mm width, 200 mm board thickness. Copper thickness: 35 μm, single-sided for prototyping circuit boards. Material: Epoxy Glass Fabric Laminate, FR4 grade providing fire resistance. Standards: UL and CSA approvals ensuring compliance and safety.
Fire resistance rating: UL 94-V0 for enhanced durability. Usage: suitable for industrial, laboratory, and electronics prototyping.
This product is a reliable choice for engineers and technicians involved in PCB prototyping and electronic assembly manufacturing. Explore related Copper Clad Boards from the CIF brand and enhance your electronics project quality with this professional-grade laminate.
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