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CIF Copper Clad Board Epoxy Glass Fabric Laminate 2 Sides 35μm Copper Thickness 1.6mm Board Thickness 300mm Length AE20

Category Copper Clad Boards Brand CIF Condition New

Specifications

Country of Origin France
Brand CIF
Length 300mm
Model AE20
Board Material Epoxy Glass Fabric Laminate
Standards/Approvals MIL 13949, UL94 VO
Number of Sides 2
Board Thickness 1.6mm
FR Material Grade FR4
Copper Thickness 35μm

Key Features

  • The board is made from high-quality Epoxy Glass Fabric Laminate material.
  • It has copper plating on both sides with a thickness of 35 micrometers.
  • The substrate thickness is 1.6 millimeters, meeting FR4 fire resistance standards.
  • The board length measures 300 millimeters suitable for various prototyping applications.
  • It complies with MIL 13949 and UL94 VO standards for reliability and safety.
  • Manufactured in France ensuring adherence to international quality norms.
  • The board is untreated and does not have photoresist applied.
  • Each board is individually packaged in protective plastic bags to prevent damage.

Product Description

CIF AE20 Copper Clad Board Epoxy Glass Fabric Laminate is a premium double-sided copper-plated prototyping board designed for electronic circuit fabrication and development. Featuring 35 micrometers copper thickness on both surfaces and a robust 1.6 mm thick FR4 grade epoxy glass laminate substrate, this board ensures excellent electrical and mechanical performance.The 300 mm length dimension provides ample working area for complex circuit layouts and DIY electronic projects. Constructed with eight layers of glass cloth reinforcement, the substrate offers mechanical strength and thermal stability required for soldering and assembly processes.

This board meets stringent military grade MIL 13949 and UL94 VO fire prevention standards, making it suitable for industrial, laboratory, HVAC prototyping, manufacturing, and other professional electronic applications that demand quality and safety compliance.

Note that the board is untreated and does not include photoresist, allowing for customization with engraving, etching, or solder mask application according to user needs.

The board material is Epoxy Glass Fabric Laminate (FR4), known for its durability and insulation properties. Copper plating thickness is 35 micrometers on both sides, suitable for reliable signal and power connections. Board thickness of 1.6 millimeters ensures rigidity and supports multi-layer circuit designs.

Length of the board is 300 millimeters, providing sufficient prototyping space. Standards include MIL 13949 and UL94 VO, verifying enhanced flame resistance. Origin: Manufactured in France under precise quality controls.

This copper clad board is ideal for electronics professionals, students, and hobbyists performing PCB prototyping, repair, or custom circuit design. Explore more Copper Clad Boards and prototyping materials in the Electronics Components category at EnvMart.

CIF Copper Clad Board Epoxy Glass Fabric Laminate 2 Sides 35μm Copper Thickness 1.6mm Board Thickness 300mm Length AE20
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Frequently Asked Questions

The copper plating on this board has a thickness of 35 micrometers on both sides.

This model measures 300 millimeters in length and has a board thickness of 1.6 millimeters.

The board is made from Epoxy Glass Fabric Laminate, classified under FR4 material grade.

It complies with MIL 13949 and UL94 VO standards for reliability and fire resistance.

Yes, the board's thickness of 1.6 millimeters ensures rigidity, making it suitable for multi-layer circuit designs.

The board features copper plating on both sides, making it a double-sided copper clad board.

This board is manufactured in France, ensuring adherence to international quality norms.

It is suitable for industrial, laboratory, HVAC prototyping, manufacturing, and other professional electronic applications.

Yes, each board is individually packaged in protective plastic bags to prevent damage.

Yes, the board is untreated and does not include photoresist, allowing for customization with engraving, etching, or solder mask application.

It is primarily used for electronic circuit fabrication and development, making it ideal for PCB prototyping and repair.

The board meets UL94 VO fire prevention standards, indicating its enhanced flame resistance.

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