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onsemi 1-Element Bi-Directional TVS Diode 250 mW Surface Mount 2-Pin X2-DFN ESD5581N2T5G

Category TVS Diode Brand onsemi Condition New

Specifications

Country of Origin China
Brand onsemi
Height 0.28mm
Length 0.66mm
Model ESD5581N2T5G
Width 0.36mm
Mount Type Surface
Maximum Operating Temperature 150°C
Package Type X2-DFN
Minimum Operating Temperature -55°C
Interfaces USB ID
Pin Count 2
Number of Elements per Chip 1
Clamping Voltage VC 12V
Diode Configuration Single
Direction Type Bi-Directional
Minimum Breakdown Voltage Vbr 5.2V
Maximum Reverse Stand-off Voltage Vwm 5V
Peak Pulse Power Dissipation Pppm 250mW
Test Current It 1mA
Maximum Peak Pulse Current Ippm 6A
Maximum Reverse Leakage Current 100nA

Key Features

  • Single diode configuration with bi-directional protection.
  • Surface mount package type X2-DFN with 2 pins.
  • Maximum peak pulse power dissipation of 250 mW.
  • Minimum breakdown voltage of 5.2 V and maximum reverse stand-off voltage of 5 V.
  • Clamping voltage of 12 V ensures excellent protection.
  • Operating temperature range from -55°C to 150°C.
  • Low capacitance suitable for high frequency designs such as USB 2.0.
  • Maximum peak pulse current of 6 A.

Product Description

onsemi ESD5581N2T5G 1-Element Bi-Directional TVS Diode, 250 mW, Surface Mount 2-Pin X2-DFN package offers reliable electrostatic discharge protection for voltage sensitive components. Its single diode, bi-directional design provides excellent clamping capability and low capacitance of 5.0 μF, making it ideal for applications requiring compact size and fast response times, especially in high frequency circuits such as USB 2.0 high speed interfaces.

This TVS diode features a minimum breakdown voltage of 5.2 V and a maximum reverse stand-off voltage of 5 V providing robust protection against transient voltage events. The compact X2-DFN surface mount package measures just 0.66 mm in length, 0.36 mm in width, and 0.28 mm in height, facilitating dense PCB layouts with limited board space.

The device supports a peak pulse power dissipation of 250 mW and a peak pulse current of 6 A, suitable for protecting integrated circuits from electrostatic discharge. It operates efficiently across a wide temperature range from -55°C to 150°C and has a maximum reverse leakage current of 100 nA, ensuring reliability and low power loss.

Typical applications include USB ID, GPIO protection, µSD card interfaces, flash drives, and hard disk drives. The diode is surface mounted for automated assembly and optimized for compact electronic devices where space saving and effective ESD protection are essential.

Single diode configuration with bi-directional protection. Low capacitance suitable for high frequency USB 2.0 applications. Peak pulse power dissipation of 250 mW ensures reliable surge protection. Compact X2-DFN surface mount package with minimal height.

Wide operating temperature range from -55°C to 150°C for industrial environments. Ideal for electrostatic discharge protection on voltage sensitive components. Low reverse leakage current minimizes power consumption. Applications include USB ID, GPIO, µSD protection, flash drives, and HDDs.

Explore the full range of TVS Diodes at EnvMart for versatile semiconductor protection solutions.

onsemi 1-Element Bi-Directional TVS Diode 250 mW Surface Mount 2-Pin X2-DFN ESD5581N2T5G
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Frequently Asked Questions

The peak pulse power dissipation of this model is 250 mW, which ensures reliable surge protection for voltage sensitive components.

It operates efficiently across a wide temperature range from -55°C to 150°C, making it suitable for various industrial environments.

The clamping voltage of this diode is 12 V, providing excellent protection against transient voltage events.

The minimum breakdown voltage is 5.2 V, which is crucial for effective electrostatic discharge protection.

The dimensions of the X2-DFN package are 0.66 mm in length, 0.36 mm in width, and 0.28 mm in height.

This model can handle a maximum peak pulse current of 6 A, which is essential for protecting integrated circuits.

It is compatible with USB ID interfaces, making it suitable for high-speed applications such as USB 2.0.

This diode features a pin count of 2, which is typical for surface mount applications.

Typical applications include USB ID, GPIO protection, µSD card interfaces, flash drives, and hard disk drives.

It uses a single diode configuration with bi-directional protection, providing effective ESD protection for sensitive components.

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