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Infineon Isolated HEXFET P-Channel MOSFET 3.4 A 55 V Enhancement 8-Pin SOIC IRF7342TRPBF

Category Semiconductor Brand Infineon Condition New

Specifications

Country of Origin China
Brand Infineon
Height 1.5mm
Length 5mm
Model IRF7342TRPBF
Width 4mm
Mount Type Surface
Series HEXFET
Maximum Operating Temperature 150°C
Package Type SOIC
Minimum Operating Temperature -55°C
Pin Count 8
Number of Elements per Chip 2
Channel Type Type P
Maximum Continuous Drain Current Id 3.4A
Maximum Drain Source Voltage Vds 55V
Maximum Drain Source Resistance Rds 170mΩ
Channel Mode Enhancement
Maximum Power Dissipation Pd 2W
Typical Gate Charge Qg @ Vgs 26nC
Maximum Gate Source Voltage Vgs -20, +20V
Forward Voltage Vf -1.2V
Transistor Configuration Isolated

Key Features

  • Maximum continuous drain current of 3.4 A ensures robust power handling.
  • Drain-source voltage rating up to 55 V allows usage in moderate voltage applications.
  • Surface mount SOIC 8-pin package supports compact and efficient PCB layouts.
  • Low maximum drain-source resistance (Rds) of 170 mΩ reduces conduction losses.
  • Operating temperature range from -55°C to 150°C provides reliable performance in harsh environments.
  • Enhancement mode transistor configuration suitable for switching and amplification.
  • Typical gate charge of 26 nC at Vgs promotes fast switching.
  • Gate-source voltage tolerance of ±20 V enhances operational safety.

Product Description

Infineon IRF7342TRPBF is an isolated HEXFET power MOSFET designed for efficient power management in electronic systems. This P-channel enhancement mode MOSFET supports a maximum continuous drain current of 3.4 A and a drain-source voltage of 55 V, making it suitable for various industrial and electronic applications including power converters, motor control, and battery management systems.

Featuring a surface mount 8-pin SOIC package, the device enables streamlined PCB assembly and compact designs. Its low maximum drain-source resistance (Rds) of 170 mΩ improves energy efficiency by reducing conduction losses. The gate charge of 26 nC ensures quick switching operation while the transistor maintains stable performance within an operating temperature range of -55°C to 150°C.

The gate-source voltage withstands up to ±20 V, protecting the device during transient conditions. The isolated transistor configuration further minimizes leakage currents and cross-interference, improving circuit reliability. Dimensions are optimized at 5 mm length, 4 mm width, and 1.5 mm height for flexible integration.

Maximum continuous drain current of 3.4 A ensures robust power handling. Drain-source voltage rating up to 55 V allows usage in moderate voltage applications. Surface mount SOIC 8-pin package supports compact and efficient PCB layouts.

Low maximum drain-source resistance (Rds) reduces conduction losses. Wide temperature operational range from -55°C to 150°C allows diverse environmental use. Enhancement mode P-channel transistor suitable for switching and amplification.

Typical gate charge of 26 nC for fast and efficient switching. Gate-source voltage tolerance ±20 V ensures device safety under transient loads. Isolated transistor configuration minimizes parasitic effects for stability.

Compact housing dimensions: 5 mm x 4 mm x 1.5 mm.

This MOSFET is widely applicable to industrial power management circuits, automation control equipment, motor drivers, and energy efficient electronic systems. Its electrical and mechanical specifications make it ideal for engineers seeking a reliable, high-performance P-channel MOSFET solution.

Explore the wide range of Infineon Semiconductor products on EnvMart for optimized industrial and electronic designs.

Infineon Isolated HEXFET P-Channel MOSFET 3.4 A 55 V Enhancement 8-Pin SOIC IRF7342TRPBF
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Frequently Asked Questions

The maximum continuous drain current of this model is 3.4 A.

It has a drain-source voltage rating of up to 55 V, suitable for moderate voltage applications.

The dimensions of this MOSFET are 5 mm in length, 4 mm in width, and 1.5 mm in height.

This unit uses a surface mount SOIC 8-pin package, allowing for compact PCB layouts.

The maximum drain-source resistance (Rds) is 170 mΩ, which helps reduce conduction losses.

The typical gate charge at Vgs is 26 nC, promoting fast switching operations.

It operates within a temperature range from -55°C to 150°C, making it suitable for harsh environments.

The gate-source voltage tolerance is ±20 V, enhancing operational safety during transient conditions.

This model features an isolated transistor configuration, which minimizes leakage currents and cross-interference.

It is suitable for various applications including power converters, motor control, and battery management systems.

This MOSFET has 8 pins, facilitating its integration into electronic circuits.

This model belongs to the HEXFET series, designed for efficient power management.

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