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| Country of Origin | India |
|---|---|
| Voltage | 318V |
| Brand | Samtec |
| Orientation | Straight |
| Current | 2.2A |
| Model | ERF8 |
| Mount Type | Surface |
| Housing Material | Liquid Crystal Polymer |
| Contact Material | Beryllium Copper Alloy |
| Series | ERF8 |
| Termination Type | Solder |
| Maximum Operating Temperature | 125°C |
| Sub Type | Rugged High-Speed Socket Strip |
| Minimum Operating Temperature | -55°C |
| Number of Rows | 2 |
| Positions | Up to 200 |
| Pitch | 0.8mm |
| Contact Plating | Gold |
| Number of Contacts | 60 |
| Connector System | Board-to-Board |
| Stacking Height | 18mm |
| Row Pitch | 4.5mm |
| Stack Height | 7.00 mm - 16.00 mm |
Samtec ERF8 Series PCB Socket model ERF8 is a rugged high-speed socket strip engineered with 60 contacts arranged across 2 rows at 0.8 mm pitch. It is designed for surface mounting on printed circuit boards providing a reliable board-to-board connector system.
The socket features housing made from Liquid Crystal Polymer, providing excellent mechanical strength and high temperature resistance with an operating range from -55°C to 125°C. With a current capacity of 2.2 amperes and voltage rating of 318 volts, it supports demanding electrical requirements for industrial and telecommunications applications.
Contact surfaces utilize gold plating over Beryllium Copper Alloy, ensuring superior conductivity and enhanced wear life through smooth broad milled contact design. The ergonomic straight orientation and a stacking height of 18 mm support compact and scalable stacking configurations, with a row pitch of 4.5 mm for precise alignment.
The ERF8 series incorporates Rugged Edge Rate® contact technology, enabling high-speed signal integrity, and can accommodate up to 200 positions, making it suitable for complex board assemblies. It is dual-sourced by Hirose and fits a variety of industrial, laboratory, telecommunications, and manufacturing use cases requiring robust PCB socket solutions.
The solder termination type promotes stable mechanical and electrical connection on surface mount boards, facilitating efficient assembly and maintenance processes. This product is crafted to support high reliability in harsh environments and is ideal for integration in automotive electronics, industrial controls, and high-frequency systems.
Constructed with Liquid Crystal Polymer housing for durability and high performance. Supports board-to-board connector system with solder termination type. Features straight orientation and surface mount for easy integration.
Operates reliably from -55°C to 125°C in demanding environments. Current rating of 2.2 A and voltage rating of 318 V ensure robust electrical performance. Contact material is gold-plated Beryllium Copper Alloy for excellent conductivity and wear life.
Stacking height of 18 mm and row pitch of 4.5 mm facilitate versatile stacking applications. Designed to support up to 200 positions with smooth broad milled contact surfaces. Ideal for high-speed signal applications with rugged edge rate® contact technology.
Explore the full range of PCB Sockets and connectors at EnvMart for industrial and electronics manufacturing needs.
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