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Samtec Rugged High-Speed PCB Socket, 60-Contact, 2 Row, 0.8 mm Pitch, Surface Mount, Liquid Crystal Polymer Housing ERF8

Category PCB Socket Brand Samtec Condition New

Specifications

Country of Origin India
Voltage 318V
Brand Samtec
Orientation Straight
Current 2.2A
Model ERF8
Mount Type Surface
Housing Material Liquid Crystal Polymer
Contact Material Beryllium Copper Alloy
Series ERF8
Termination Type Solder
Maximum Operating Temperature 125°C
Sub Type Rugged High-Speed Socket Strip
Minimum Operating Temperature -55°C
Number of Rows 2
Positions Up to 200
Pitch 0.8mm
Contact Plating Gold
Number of Contacts 60
Connector System Board-to-Board
Stacking Height 18mm
Row Pitch 4.5mm
Stack Height 7.00 mm - 16.00 mm

Key Features

  • Constructed with Liquid Crystal Polymer housing for durability and high performance.
  • Supports board-to-board connector system with solder termination type.
  • Features straight orientation and surface mount for easy integration.
  • Operates reliably from -55°C to 125°C in demanding environments.
  • Current rating of 2.2 A and voltage rating of 318 V ensure robust electrical performance.
  • Contact material is gold-plated Beryllium Copper Alloy for excellent conductivity and wear life.
  • Stacking height of 18 mm and row pitch of 4.5 mm facilitate versatile stacking applications.
  • Designed to support up to 200 positions with smooth broad milled contact surfaces.

Product Description

Samtec ERF8 Series PCB Socket model ERF8 is a rugged high-speed socket strip engineered with 60 contacts arranged across 2 rows at 0.8 mm pitch. It is designed for surface mounting on printed circuit boards providing a reliable board-to-board connector system.

The socket features housing made from Liquid Crystal Polymer, providing excellent mechanical strength and high temperature resistance with an operating range from -55°C to 125°C. With a current capacity of 2.2 amperes and voltage rating of 318 volts, it supports demanding electrical requirements for industrial and telecommunications applications.

Contact surfaces utilize gold plating over Beryllium Copper Alloy, ensuring superior conductivity and enhanced wear life through smooth broad milled contact design. The ergonomic straight orientation and a stacking height of 18 mm support compact and scalable stacking configurations, with a row pitch of 4.5 mm for precise alignment.

The ERF8 series incorporates Rugged Edge Rate® contact technology, enabling high-speed signal integrity, and can accommodate up to 200 positions, making it suitable for complex board assemblies. It is dual-sourced by Hirose and fits a variety of industrial, laboratory, telecommunications, and manufacturing use cases requiring robust PCB socket solutions.

The solder termination type promotes stable mechanical and electrical connection on surface mount boards, facilitating efficient assembly and maintenance processes. This product is crafted to support high reliability in harsh environments and is ideal for integration in automotive electronics, industrial controls, and high-frequency systems.

Constructed with Liquid Crystal Polymer housing for durability and high performance. Supports board-to-board connector system with solder termination type. Features straight orientation and surface mount for easy integration.

Operates reliably from -55°C to 125°C in demanding environments. Current rating of 2.2 A and voltage rating of 318 V ensure robust electrical performance. Contact material is gold-plated Beryllium Copper Alloy for excellent conductivity and wear life.

Stacking height of 18 mm and row pitch of 4.5 mm facilitate versatile stacking applications. Designed to support up to 200 positions with smooth broad milled contact surfaces. Ideal for high-speed signal applications with rugged edge rate® contact technology.

Explore the full range of PCB Sockets and connectors at EnvMart for industrial and electronics manufacturing needs.

Samtec Rugged High-Speed PCB Socket, 60-Contact, 2 Row, 0.8 mm Pitch, Surface Mount, Liquid Crystal Polymer Housing ERF8
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Frequently Asked Questions

The maximum voltage rating for this model is 318 volts.

It has a current rating of 2.2 amperes.

The housing material is Liquid Crystal Polymer, which provides excellent mechanical strength and high temperature resistance.

It operates reliably within a temperature range of -55°C to 125°C.

This socket features 60 contacts arranged in 2 rows.

The pitch size of the contacts is 0.8 mm.

It uses a solder termination type, which promotes stable mechanical and electrical connections on surface mount boards.

The stacking height of this model is 18 mm.

The contact material is gold-plated Beryllium Copper Alloy, ensuring superior conductivity and wear life.

It supports a board-to-board connector system, suitable for various applications in industrial and telecommunications environments.

This socket is designed to support up to 200 positions.

The row pitch is 4.5 mm, facilitating precise alignment in board assemblies.

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